Method and apparatus of symmetrically chamfering substrate
a chamfering table and substrate technology, applied in the direction of edge grinding machines, grinding machine components, manufacturing tools, etc., can solve the problems of mass damage to productivity, increased cost due to the replacement of components, etc., to exclude labor and time loss, determine the degree of chamfering table deterioration, the effect of reducing the cost of replacemen
Inactive Publication Date: 2014-12-04
SAMSUNG CORNING PRECISION MATERIALS CO LTD
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Benefits of technology
The invention allows for an automatic and constant alignment of the chamfering wheel with the center point of the cross-section of the edge of the substrate, without the need for hardware-based adjustments. This results in a symmetrically chamfered edge of the substrate and allows for quick detection and addressing of any deterioration in the chamfering table. The invention also allows for a simple and efficient method of chamfering without sacrificing productivity, and excludes the need for compensation of the chamfering table. Additionally, the invention improves the efficiency and accuracy of the chamfering process, and enables mass-production of chamfered substrates with low levels of differences in chamfered width between the upper and lower surface.
Problems solved by technology
However, this operation requires a process of stopping the chamfering of the substrate and disassembling, reassembling and precisely compensating the table, thereby causing massive damage to productivity.
This also has the problem of the increased cost due to the replacement of the component.
Method used
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[0027]Reference will now be made in detail to various embodiments of the present invention, examples of which are illustrated in the accompanying drawings and described below, so that a person having ordinary skill in the art to which the present invention relates can easily put the present invention into practice.
[0028]Throughout this document, reference should be made to the drawings, in which the same reference numerals and signs are used throughout the different drawings to designate the same or similar components. In the following description of the present invention, detailed descriptions of known functions and components incorporated herein will be omitted when they may make the subject matter of the present invention unclear.
[0029]FIG. 3 is a flow diagram depicting a method of symmetrically chamfering a substrate according to an embodiment of the invention, FIG. 4 is a schematic view showing a plurality of measuring points on the edges of a substrate, and FIG. 5 is a side cr...
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Abstract
A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.
Description
CROSS REFERENCE TO RELATED APPLICATION[0001]The present application claims priority from Korean Patent Application Number 10-2013-0060306 filed on May 28, 2013, the entire contents of which are incorporated herein for all purposes by this reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method and apparatus of symmetrically chamfering a substrate, and more particularly, to a method and apparatus of symmetrically chamfering a substrate by measuring an asymmetric chamfering deviation of the substrate and controlling the position of a chamfering wheel based on the asymmetric chamfering deviation.[0004]2. Description of Related Art[0005]In a plurality of fields, the edges of substrates are required to be chamfered. For instance, glass substrates which are used for flat panel displays, such as a liquid crystal display (LCD), a plasma display panel (PDP) and an electroluminescent (LE) display, can be manufactured by melting, shap...
Claims
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IPC IPC(8): B24B9/08B24B49/12
CPCB24B49/12B24B9/08B24B49/02B24B9/10
Inventor HAN, MYEONGBO
Owner SAMSUNG CORNING PRECISION MATERIALS CO LTD