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Filing assembly

a technology of filling assembly and filling plate, which is applied in the direction of special packaging, dough shaping, printing, etc., can solve the problems of reducing the quality of filling and thus the quality of the board, and achieve the effect of reliable and yet efficient manner

Active Publication Date: 2012-06-05
ITC INTERCIRCUIT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The invention provides a filling assembly for holes in a plate that can reliably and efficiently fill the holes with a filling material. The assembly includes a support device for the plate, a filling device with a feeding channel for feeding the filling material to the plate, and a vibration device that vibrates the feeding channel to accelerate the filling operation and ensure a smooth filling process without air bubbles. The assembly can be used with a moveable support device and a moveable suction device for evacuating the holes before filling them. The invention also includes a method of operation for the filling assembly."

Problems solved by technology

In this context, for example air bubble and / or foreign particle inclusions may occur when the holes are filled with the filling material, which reduces the quality of the filling and thus the quality of the board.

Method used

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first embodiment

[0033]In FIG. 1, a filling assembly 1 according to the invention is shown for filling blind holes 5 and through-holes 7 provided in a printed circuit board 3.

[0034]The filling assembly 1 comprises a support device 9 on which the plate 3 is supported with its lower plate side 3a. In this embodiment of the invention, the support device 9 is provided as a conveyor band and serves at the same time as a transportation device by means of which the plate 3 can be moved in the direction of the arrow A. In addition, the plate 3 is fixed to the conveyor band in such a manner, for example by means of a vacuum applied from below through a porous conveyor band, that it is secured against slipping or lifting.

[0035]In addition, the filling assembly 1 comprises a filling device 11. The filling device 11 comprises a filling material source 13 and a feeding channel 15 communicating with the filling material source 13. The filling device 11 is movable in a horizontal direction as well as in a vertical...

second embodiment

[0044]In FIG. 3, a filling assembly 1 is shown according to the invention, comprising a support device 9, on which the plate 3 is supported with its lower plate side 3a, and a suction-filling head 31 facing the upper side of the plate 3b. The support device 9 and the suction-filling head 31 are moveable relative to each other.

[0045]The suction-filling head 31 comprises a feeding channel 15 connected to a filling material source which is not shown, which leads to an output opening 19 held adjoining the upper side of the plate 3b, and a suction channel 25 connected to a suction device which is not shown, which leads to a suction opening 27 held adjoining the upper side of the plate 3b, for local evacuation of the respective hole to be filled. The feeding channel 15 passes at its end portion facing the upper side of the plate 3b in an oblique manner through the suction-filling head 31, such that this portion is inclined to the upper side of the plate 3b. The suction channel passes stra...

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Abstract

Filling assembly for filling holes formed in a plate, such as a printed circuit board, with a filing material, comprising a support device for supporting the plate, a filling device having a filling material source and a feeding channel connected to the filling material source for feeding filling material from the filling material source to the plate supported by the support device, wherein the feeding channel leads to an output opening held adjoining the plate for filling the filling material into the respective hole of the supported plate, and a vibration device connected to a side wall of the feeding channel, by which the side wall can be vibrated at a particular frequency transverse to the feeding channel, such that the feeding channel is correspondingly diminished at least adjacent to its output opening periodically.

Description

[0001]This application claims priority to German Patent Application No. 10 2007 053 513.0-34 filed on Nov. 9, 2007 under the Paris Convention, which application is incorporated by reference.I. FIELD OF THE INVENTION [0002]The invention relates to a filling assembly for filling holes formed in a plate, such as in a printed circuit board with a filling material, and to the use of the same for filling blind holes formed in a plate.II. BACKGROUND OF THE INVENTION [0003]In the production of multilayered printed circuit boards holes are formed in said boards to generate contact between the single layers, which holes are then filled with a conductive material or which, for the purpose of saving such a material, are coated for example only on their peripheral walls with metal, and are then closed with a more cost-effective material, such as epoxy resin.[0004]The holes are closed in order to minimize the total surface of the printed circuit board. In addition, for example soldering base pads...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): B05C5/02
CPCH05K3/4053H05K2203/0126H05K2203/0195H05K2203/0292H05K2203/082Y10S141/01B41F15/06B41F15/14H05K3/40
Inventor HEIN, HUBERTUS
Owner ITC INTERCIRCUIT ELECTRONICS