Semiconductor integrated circuit device

A technology of integrated circuits and semiconductors, which is applied in the field of semiconductor integrated circuit devices, and can solve problems such as the widening of the power supply unit 6a

Inactive Publication Date: 2008-02-13
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, since the arrangement pitch of the pads 9 is determined according to the width of the power supply unit 6a, the difficulty of miniaturization of the microcomputer (semiconductor integrated circuit device) lies in such an arrangement that the width of the power supply unit 6a becomes larger

Method used

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  • Semiconductor integrated circuit device
  • Semiconductor integrated circuit device
  • Semiconductor integrated circuit device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0061] This embodiment will describe an example in which the power supply terminal of the internal circuit is set or arranged near the internal power supply wiring instead of close to the signal power supply terminal.

[0062] 1 is a typical plan view showing the layout of a microcomputer (semiconductor integrated circuit device) shown in Embodiment Mode 1;

[0063] Figure 2 is an enlarged typical plan view of the part depicted in Figure 1;

[0064] Figure 3 is an enlarged typical plan view of the portion illustrated in Figure 2;

[0065] Fig. 4 is a typical plan view partially enlarged as shown in Fig. 3;

[0066] Fig. 5 is a block diagram illustrating the schematic structure of the signal unit shown in Fig. 4;

[0067] Fig. 6 is a block diagram illustrating the schematic structure of the internal circuit power supply unit shown in Fig. 4;

[0068] Fig. 7 is an equivalent circuit diagram showing an example of an input / output circuit incorporated in the signal unit shown in...

Embodiment approach 2

[0103] The present invention will describe an example in which pads are provided on the input / output unit.

[0104] FIG. 13 is a typical plan view showing the layout of the microcomputer described in Embodiment 2, and FIG. 14 is a typical plan view showing a part shown in FIG. 13 enlarged.

[0105] As shown in FIGS. 13 and 14 , a plurality of bonding pads 9 are provided within the outer ends of their respective input / output units 4 . In this embodiment, a plurality of bonding pads 9 are arranged to overlap their corresponding input / output units in a planar manner. With such a structure, the distance L1 between the edge of the semiconductor chip 1 and the outer end of each input / output unit 4 can be shortened. Therefore, it is possible to downsize the semiconductor chip 1 (microcomputer).

[0106] In order to avoid the stress during press-fitting and the impact when making columnar bumps, any circuit whose characteristics and breakdown are in danger of degrading due to stress...

Embodiment approach 3

[0108] FIG. 15 is a typical plan view showing the layout of the microcomputer described in Embodiment 3, and FIG. 16 is a typical plan view showing a part of FIG. 15 enlarged.

[0109] As shown in FIGS. 15 and 16, internal circuit power supply terminals 11a are respectively provided inside the input / output unit 4 so as to overlap the internal circuit power supply wiring 8a in a planar manner. The signal terminal 10 and the power supply terminal 11b of the I / O unit are arranged to overlap their corresponding I / O unit 4 in a planar manner. Therefore, the width of each inner circuit power supply unit 6a can be narrowed. With such a structure, the size of the semiconductor chip 1 (microcomputer) can be made smaller.

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PUM

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Abstract

A semiconductor integrated circuit device has a semiconductor substrate with a plurality of pads disposed over a main surface of the substrate along one side thereof. A plurality of input / output cells are disposed corresponding to the plural pads over the main surface of the substrate. An internal circuit forming section is disposed over the main surface of the substrate. Power supply wirings for the internal circuit supply potentials to the internal circuit forming section. The plural input / output cells include signal cells and power supply cells for internal circuit respectively. Signal pads are disposed corresponding to the signal cells and electrically connected the signal cells. Power supply pads for the internal circuit are respectively disposed corresponding to the power supply cells and electrically connected to the power supply cells and the power supply wirings.

Description

technical field [0001] The present invention relates to semiconductor integrated circuit devices, and more particularly, to a technique which is effective if applied to a microcomputer in which logic operation circuits and memory circuits are mixed on one semiconductor chip. Background technique [0002] A semiconductor integrated circuit device called, for example, a microcomputer is known as a semiconductor integrated circuit device. FIG. 26 is a typical plan view showing a conventional microcomputer, and FIG. 27 is an enlarged typical plan view of the portion shown in FIG. 26. Referring to FIG. [0003] As shown in FIG. 26, a conventional microcomputer is mainly made of a semiconductor chip 30, the plane of which is square. The internal circuit fabrication area 2 is provided in the middle portion of the main surface of the semiconductor chip 30 . Circuit blocks such as logical operation circuits, storage circuits, etc. are provided in the inner circuit fabrication area ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/04G11C7/10H01L21/82H01L21/822H01L23/528
CPCH01L23/5286H01L2924/3011H01L2224/73204H01L2224/16225H01L2224/32225H01L2224/45144H01L2224/05571H01L2224/05573H01L2224/056H01L24/05H01L2924/00H01L2924/00014G11C7/10
Inventor 小西聪片桐光昭柳泽一正
Owner MURATA MFG CO LTD
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