Semiconductor integrated circuit device
A technology of integrated circuits and semiconductors, which is applied in the field of semiconductor integrated circuit devices, and can solve problems such as the widening of the power supply unit 6a
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Embodiment approach 1
[0061] This embodiment will describe an example in which the power supply terminal of the internal circuit is set or arranged near the internal power supply wiring instead of close to the signal power supply terminal.
[0062] figure 1 It is a typical plan view showing the layout of the microcomputer (semiconductor integrated circuit device) shown in Embodiment 1;
[0063] figure 2 for figure 1 Exaggerated typical floor plans of parts described;
[0064] Figure 3 is figure 2 Exaggerated typical floor plan of the portion illustrated;
[0065] Figure 4 It is a typical plan view partially enlarged as shown in Fig. 3;
[0066] Figure 5 for illustration Figure 4 A block diagram of the schematic structure of the signal unit shown;
[0067] Figure 6 for illustration Figure 4 A block diagram of the schematic structure of the internal circuit power supply unit shown;
[0068] Figure 7 To indicate installed in Figure 5 Equivalent circuit diagram of an example in...
Embodiment approach 2
[0103] The present invention will describe an example in which pads are provided on the input / output unit.
[0104] Figure 13 is a typical plan view showing the layout of the microcomputer described in Embodiment 2, and FIG. 14 is Figure 13 Exaggerated typical floor plan of portions shown.
[0105] Such as Figure 13 As shown in and 14, a plurality of pads 9 are located within the outer ends of their corresponding input / output units 4. In this embodiment, a plurality of bonding pads 9 are arranged to overlap their corresponding input / output units in a planar manner. With such a structure, the distance L1 between the edge of the semiconductor chip 1 and the outer end of each input / output unit 4 can be shortened. Therefore, it is possible to downsize the semiconductor chip 1 (microcomputer).
[0106] In order to avoid the stress during press-fitting and the impact when making columnar bumps, any circuit whose characteristics and breakdown are in danger of degrading due to...
Embodiment approach 3
[0108] Figure 15 is a typical plan view showing the layout of the microcomputer described in Embodiment 3, and FIG. 16 is Figure 15 Exaggerated typical floor plan of portions shown.
[0109] Such as Figure 15 As shown in and 16, the internal circuit power supply terminals 11a are respectively provided in the input / output unit 4, and are overlapped with the internal circuit power supply wiring 8a in a planar manner. The signal terminal 10 and the power supply terminal 11b of the I / O unit are arranged to overlap their corresponding I / O unit 4 in a planar manner. Therefore, the width of each inner circuit power supply unit 6a can be narrowed. With such a structure, the size of the semiconductor chip 1 (microcomputer) can be made smaller.
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Abstract
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