Polishing device and substrate processing device

Abstract

The present invention relates to a polishing apparatus having a plurality of polishing units (30A-30D). Moving mechanisms for moving top rings (301A SIMILAR 301D) between polishing positions on the polishing surfaces and wafer receiving / delivering positions are provided in each of the polishing units. Linear transporters (5, 6) are provided for transferring the wafer between a plurality of transferring positions (TP1-TP7) including the wafer receiving / delivering positions. Pushers (33, 34, 37, 38) for receiving and delivering the wafer between the linear transporters (5, 6) and the top rings (301A-301D) are provided at the transferring positions (TP2, TP3, TP6, TP7) as the wafer receiving / delivering positions.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a polishing apparatus for polishing a polishing object such as a semiconductor wafer (wafer) into a flat and mirror-like surface. Background technique [0002] In recent years, with the progress of high integration of semiconductor devices, the wiring of circuits has been miniaturized, and the distance between wirings has become narrower and narrower. In particular, in the case of lithography with a line width of 0.5 μm or less, since the depth of focus becomes shallow, it is necessary to secure the flatness of the imaging surface of a stepper. A polishing apparatus that performs chemical mechanical polishing (CMP) is known as one means for flattening the surface of such a semiconductor wafer. [0003] This chemical mechanical polishing (CMP) apparatus includes a polishing table with a polishing cloth on it and a top ring. At the same time, the object to be p...

AI Technical Summary

Problems solved by technology

[0005] However, in the above-mentioned polishing apparatus, since it is necessary to install a pusher on each polishing unit, the installation space of the pusher is large, and the movement of the transfer robot for transferring the wafer between these pushers is very large. The space is very large, and the device is large-scaled

In addition, since the above-mentioned transfer robot cannot transfer a plurality of wafers at a time, when the above-mentioned transfer robot is used in various applications, when the transfer robot is restricted in order to transfer other wafers, the transfer of the required wafer will be delayed.

In this case, wafer processing and transportation cannot be performed efficiently, resulting in a drop in productivity.

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