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Wet etching equipment

A technology of wet etching and equipment, applied in the field of wet etching equipment, can solve the problems of large floor area, low product pass rate, inconvenient maintenance, etc., and achieve the effect of saving site area, improving product pass rate, and convenient access

Active Publication Date: 2008-09-17
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to overcome the problems of inconvenient maintenance, low product qualification rate and large floor space of the wet etching equipment in the prior art, the present invention provides a wet etching equipment that is easy to maintain, high product qualification rate and small floor space

Method used

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Embodiment Construction

[0019] see Figure 4 , is a schematic diagram of the three-dimensional structure of the wet etching equipment of the present invention. The wet etching equipment 20 includes a substrate carrying chamber 211, a dry transfer area 219, a drying chamber 218, a rinsing chamber 217, a third etching chamber 216, a second etching chamber 215, and a first etching chamber arranged in a line in order. Chamber 214 and a lifting chamber 213 also include a dry conveyor belt 212, and the dry conveyor belt 212 is positioned at the dry conveyor zone 219, the drying chamber 218, the rinsing chamber 217, the third etching chamber 216, the second etching chamber 215 and the drying chamber 215. Above the first etching chamber 214 , it is connected with the substrate carrying chamber 211 and the lifting chamber 213 .

[0020] The substrate carrying chamber 211 is respectively connected with the dry conveyor belt 212 and the dry conveying area 219; the dry conveyor belt 212 will transfer the glass ...

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Abstract

A wet etching equipment is composed of such 5 unit sequentially and linearly arrange as substrate bearing chamber, dry conveying region, drying chamber, rinsing chamber and etching region, a lift chamber and a drying conveying belt above the drying chamber, rinsing chamber and etching region.

Description

【Technical field】 [0001] The invention relates to a wet etching device. 【Background technique】 [0002] Wet etching technology has the advantages of low cost, high yield, reliability, and good selectivity to mask and base materials. It is widely used in the etching process of substrates. However, due to the large number of stages in wet etching equipment, the glass substrate transfer process is complicated. Generally, in the process of wet transfer of glass substrates with the first cleaning under high pressure, intense vibration will occur, resulting in abnormal phenomena such as chip chasing and breakage. cause a decrease in productivity. [0003] see figure 1 , is a three-dimensional schematic diagram of a prior art wet etching equipment. The wet etching equipment 10 includes a substrate carrying chamber 111, a buffer chamber 112, a first etching chamber 113, a second etching chamber 114, a third etching chamber 115, a wet transfer area 116, a rinsing chamber 117, a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/08H01L21/70
Inventor 高胜洲黄荣龙欧振宪黄昌桂陈青枫黄志鸿
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD