Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for implementing long jumping dynamic patch in embedded system

A technology for embedded systems and implementation methods, used in instrumentation, error detection/correction, computing, etc.

Inactive Publication Date: 2008-11-12
ZTE CORP
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] For the dynamic patch upgrade of embedded system software, the schemes that directly use the long jump instructions provided by the processor to implement have serious defects similar to those mentioned above.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for implementing long jumping dynamic patch in embedded system
  • Method for implementing long jumping dynamic patch in embedded system
  • Method for implementing long jumping dynamic patch in embedded system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0034] The following is a specific example of the practical application of the present invention, which is a specific application under the PowerPC processor.

[0035] see image 3 , image 3 A schematic diagram of the complete process of the dynamic patch long jump based on the PowerPC processor is given in this example. To achieve the purpose of dynamic patch long jump based on PowerPC processor, this example needs the following steps:

[0036] (1) Step 1: After the system finds an error in the program, it generates a patch file according to the patch source file (.c) (the schematic diagram of the patch file is shown in Figure 5 As shown), in the foreground according to the size of the patch small function area (one patch corresponds to a small function) and the size of the patch function are planned (satisfied that the address of the small function area and th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for realizing dynamic patch long slip of embedded system includes distributing internal memory for patch small function region and patch function region, writing address of patch small function and address of patch function into patch file, preparing relevant short skip command for patched function and relevant long skip command for small function when patch function is loaded to internal memory, realizing long skip of dynamic patch upgrading by skipping short skip to small function then to patch function when patch is activated.

Description

technical field [0001] The invention relates to a method for time-length jump in software dynamic patch upgrade, in particular to a method for realizing long-time jump when the relative addresses of the patch function and the patched function exceed the short jump address range. Background technique [0002] A software patch is a term in computer software systems and software engineering. It is generally an independent software unit released to modify certain errors in system software. The software dynamic patch upgrade technology is to complete the repair of system errors without affecting the normal operation of the system, that is, in the process of software operation, replace the old module with the patch module in real time, without interrupting the execution sequence of the original program . [0003] In the embedded field, the existing dynamic patch upgrade technology usually adopts technical solutions such as figure 1 shown. [0004] Wherein, the foreground is a t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G06F9/44G06F11/00
Inventor 王泽民徐立峰张华强
Owner ZTE CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com