Lithographic apparatus and device manufacturing method
A technology of lithography and projection devices, applied in semiconductor/solid-state device manufacturing, photolithography exposure devices, micro-lithography exposure equipment, etc., can solve the problems of reducing production time, avoiding bubble formation, and time-consuming problems
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0049] figure 1 A lithographic projection apparatus according to a specific embodiment of the present invention is schematically shown. The unit includes:
[0050] a radiation system Ex, IL for providing a radiation projection beam PB (e.g. UV radiation), in this particular example also comprising a radiation source LA;
[0051] A first target table (mask table) MT provided with a mask holder for holding a mask MA (e.g. a reticle) and connected to first positioning means for precisely positioning the mask relative to the object PL ;
[0052] A second target table (substrate table) WT provided with a substrate holder for holding a substrate W (e.g. a resist-coated silicon wafer) and connected to a second positioning device for precise positioning of the substrate relative to the object PL ;
[0053] A projection system ("lens") PL (eg mirror set) for imaging the radiation portion of mask MA onto a target portion C of substrate W (eg comprising one or more dies).
[0054] ...
Embodiment 2
[0068] A second embodiment of the invention is shown in FIG. 4 , which is an improvement over the first embodiment in that in order to remove a substrate W from the substrate table WT and place a new substrate on the substrate table WT, this embodiment allows The substrate table WT is completely clear of the projection system PL and the sealing member 12 . In this way, the device can be used with, for example, a dual stage mechanism.
[0069] In the second embodiment, the light shielding member 150 is in the form of a disc having a main cross-sectional area larger than the area of the partial area or the aperture of the sealing member 12 . The shape of the light blocking member 150 may be any shape as long as it covers the aperture. The light shielding member 150 is not a substrate, and may move relative to both the substrate table WT and the sealing member 12 and be attached to the sealing member 12 by any means, two examples of which will be described below.
[0070] Aft...
Embodiment 3
[0081] The third embodiment is the same as the second embodiment except as described below. The third embodiment is shown in Figure 7 In the present invention, the difference from the second embodiment is that the light shielding member 150 is placed inside the sealing member 12 . Similar to the second embodiment in that the light shielding member is separated from the substrate table WT. The light blocking member 150 moves under the projection system PL through a passage 250 in the sealing device 12, so that it can move from any rest position to a position blocking the aperture.
[0082] The light shielding member 150 can also be separated from the sealing device 12 and moved into the sealing device 12 with a robotic arm when needed, for example, or the light shielding member can have a series of Figure 8 The blade 300 shown in. The blade 300 works like a shutter of a camera, the blade can be moved so that it does not cover the aperture, but when multiple blades are move...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More