Miniature heat-collecting pump

Abstract

Present invention relates to a heat collection for heat radiation. It includes water inlet pipe, pump body, vane, motor, pump cover, impeller and outlet pipe, wherein the pump cover and pump body fixed joint and whose cavity forming the water jacket space, pump body set with water inlet pipe and let-off pipe respectively communicated with water jacket space, motor, impeller and vane located in water jacket space, motor mounted on pump cover, motor output fixed joint with impeller, impeller set with 2-6 vanes, it featuring bottom inner side surface set with heat radiation fins, pump body bottom outer side surface being plane and close contacted with heat source in using. Said invention has high heat exchange efficiency and small volume property.

Description

technical field [0001] The invention relates to a pump for heat dissipation. Background technique [0002] In the past 40 years, the semiconductor industry has developed rapidly following Moore's theorem, and the number of integrated transistors per unit area in a chip has doubled every 18 months; at the same time, in order to meet the growing demand for fast data processing, the computing frequency of general computing chips has also increased significantly ; And as the volume of the transistor becomes smaller and smaller, the leakage current will increase significantly, causing the heat inside the chip to rise sharply. It is far from enough to dissipate the heat only by solid heat sinks (ie: air-cooled heat sinks), because the heat dissipation efficiency and method limitations of solid heat sinks cannot meet the needs of current semiconductor product development. However, the current general liquid-cooled radiator uses a separate heat collection device and circulation pum...

AI Technical Summary

Problems solved by technology

[0002] In the past 40 years, the semiconductor industry has developed rapidly following Moore's theorem, and the number of integrated transistors per unit area in a chip has doubled every 18 months; at the same time, in order to meet the growing demand for fast data processing, the computing frequency of general computing chips has also increased significantly ; and as the size of the transistor becomes smaller and smaller, the leakage current will increase significantly, which will lead to a sharp increase in the heat generation inside the chip

It is far from enough to dissipate the heat only by solid radiators (ie: air-cooled radiators), because the heat dissipation efficiency and method limitations of solid radiators can no longer meet the needs of current semiconductor product development.

At present, the general liquid cooling radiator uses a separate heat collector and circulation pump body, which will reduce the heat collection capacity of the entire system and increase the cost of installation and maintenance.

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