Resin composition for appearance inspection of printed circuit board
A resin composition and printed circuit board technology, which is applied in the direction of assembling printed circuits, printed circuit parts, and electrical components with electrical components, which can solve the problem of low brightness level, difficult components to determine whether the components are qualified or not, and the inability to extract It can improve the recognition rate by solving problems such as differences in the characteristics of the measurement part.
Active Publication Date: 2009-10-28
TAIYO INK SUZHOU
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Problems solved by technology
[0008] In the case of a solder resist with a luminance level of 150, even if figure 1 When the component shown in (a-1) is mounted normally, the difference between the luminance level of (a) on the solder resist layer and the luminance level of the component electrode part (b) is small, so the measurement part cannot be extracted. Due to differences in characteristics, it is difficult to judge the pass / fail of component mounting
[0009] Additionally, if figure 1 In the case of component mounting abnormalities shown in (a-2), the difference between the luminance level of the inspection measurement site: (a) on the solder resist layer and the luminance level of the component electrode site (b) is small, so the measurement cannot be extracted. Due to the difference in the characteristics of the part, it is difficult to judge the pass or fail of component mounting
[0010] In the case of a solder resist with a brightness level of 20, even if figure 1 When the component shown in (a-1) is mounted normally, it is impossible to extract the characteristics of the measured part because the difference between the luminance level of (a) on the solder resist layer and the luminance level of the component body (c) is small during inspection and measurement. difference, it is difficult to judge the pass / fail of component mounting
[0011] Additionally, if figure 1 When the component shown in (a-3) is abnormally mounted or the component falls off, the difference between the luminance level of (a) on the solder resist layer and the luminance level of the component body (c) is small, so it is impossible to extract the characteristic difference of the measurement part , it is difficult to judge the pass or fail of component mounting
Method used
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[0096] Hereinafter, although an Example and a comparative example are shown and this invention is concretely demonstrated, this invention is not limited to a following example. In addition, the following "parts" mean "parts by mass" unless otherwise specified.
[0097]
[0098] The carboxylic acid-containing photocurable resin of the present invention was prepared according to the following synthesis examples.
[0099] 220 parts of cresol novolak type epoxy resin (manufactured by Dainippon Ink Chemical Industry Co., Ltd., "EPICLON" (registered trademark) N-695, epoxy equivalent: 220) was added to a four-neck flask equipped with a stirrer and a reflux condenser , Add 214 parts of carbitol acetate, heat to dissolve. Next, 0.46 parts of hydroquinone as a polymerization inhibitor and 1.38 parts of triphenylphosphine as a reaction catalyst were added. The mixture was heated to 95-105°C, 72 parts of acrylic acid was slowly added dropwise, and reacted for 16 hours. The reaction pr...
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Abstract
The present invention provides a resin composition used for visual inspection of printed circuit boards. The resin composition for visual inspection of printed circuit boards according to the present invention is characterized in that the resin composition contains (A) a colorant and (B) a curable component, and the brightness level of the cured film of the resin composition is It is in the range of 30-120.
Description
technical field [0001] The present invention relates to a resin composition, a cured product thereof, and a printed wiring board provided with a cured film of the resin composition, which improve the recognition rate of electronic components in the appearance inspection of printed wiring boards. Background technique [0002] In the mounting process of high-density and diversified printed circuit boards, the mounting state of electronic components and the quality of solder joints will affect the reliability of products. Therefore, it is used to improve work efficiency and ensure work quality. The automation and mechanization of visual inspections have been popularized. [0003] As a method of visual inspection of electronic components mounted on printed circuit boards, as proposed in Patent Document 1, for example, a CCD camera is used to photograph the components to be inspected, the solder pads in contact with them, and the solder resist, and obtain the respective luminance...
Claims
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IPC IPC(8): C08L101/00C08K7/12H05K1/02H05K13/08H05K3/34
Inventor 栗原弘司木村纪雄大野义弘岩山弦人
Owner TAIYO INK SUZHOU