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Combination method of soft and hard printed circuit board

A technology for printed circuit boards and rigid circuit boards, applied in the field of bonding, can solve the problems of fiber pulling, soft board damage, and no protection measures.

Inactive Publication Date: 2009-11-25
TRIPOD WUXI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the general soft-rigid board bonding process, it is usually directly bonded without any protective measures, which makes the soft board vulnerable to damage, and the bonding area between the soft-hard board is not smooth enough, and even have fiber pulling problems

Method used

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  • Combination method of soft and hard printed circuit board
  • Combination method of soft and hard printed circuit board
  • Combination method of soft and hard printed circuit board

Examples

Experimental program
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Embodiment Construction

[0015] see Figure 1 to Figure 5 , Figure 1 to Figure 5 It is a schematic diagram of the present invention. Before proceeding with the bonding process, prepare as figure 1 flex circuit board shown, and figure 2 A rigid circuit board 30 with a second wiring layer 31 is shown. Such as figure 1 As shown, the first substrate 10 of the flexible circuit board has a first circuit layer 11 and a power / ground layer 12 . The first circuit layer 11 includes circuit wires 13 .

[0016] In simple terms, such as Figure 4 As shown, the bonding method of the present invention mainly utilizes the pressure bonding adhesive 23 to fill the punching line 32 of the rigid circuit board 30 (such as image 3 shown), so that the part of the rigid circuit board 30 that has been cut off is temporarily fixed on the flexible circuit board, so that not only the circuit layer of the flexible circuit board can be protected during the entire bonding process, but also there is no glass fiber pulling, ...

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Abstract

The method for combining flexible and hard printed circuit boards of the present invention mainly provides flexible circuit boards and rigid circuit boards with circuit layers first, and uses bonding glue to bond the rigid circuit boards to the flexible circuit boards that have been laminated with a cover film. Press-bonded to the cover film of the flexible circuit board, and then remove the second substrate that is not a bonding area in the rigid circuit board, and the third bonding glue and the outer metal layer on the opposite position when the subsequent process is completed , to expose the cover film. In this way, not only the circuit layer of the flexible circuit board can be protected during the whole bonding process, but also there are no problems such as glass fiber pulling and copper foil exposure.

Description

technical field [0001] The invention relates to a combination method, in particular to a combination method of soft and hard printed circuit boards. Background technique [0002] To put it simply, a Rigid-Flex Printed Board is an electronic component that combines a flexible board and a rigid board into one product. Its development history has exceeded 20 years. The early uses were mostly in the fields of military, medical, and industrial instruments. In recent years, they have been applied to terminal products such as mobile phone communications and consumer electronics (digital camera DSC, digital video camera DV, etc.). The application of soft and hard boards in mobile phones is common in the turning point of foldable mobile phones, image modules, buttons and radio frequency modules. [0003] The advantages of using rigid-flex boards in mobile phones include easier integration of mobile phone parts and higher reliability of signal transmission. Using a rigid-flex board ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36
Inventor 杨伟雄林信成王赞钦田景文林圣杰
Owner TRIPOD WUXI ELECTRONICS
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