Electrode wire lead-out structure of field emission display

Abstract

An extraction structure of electrode leads of a field emission display comprises a cathode plate, an anode plate and an encapsulation frame; wherein, the cathode plate is jointed with the anode plate in a corresponding way; the cathode plate is provided with a cathode base plate which is provided with a cathode conducting layer, and the anode plate is provided with an anode base plate which is provided with an anode conducting layer; in addition, the encapsulation frame is arranged between the cathode base plate and the anode base plate, one side of the encapsulation frame is extended with a down-lead plate, a plurality of electrode leads are arranged on the two end surfaces of the down-lead plate, and conducting layers are arranged between the electrode leads and the cathode base plate as well as the anode base plate, so as to be electrically connected with the cathode conducting layer and the anode conducting layer; the electric connection between the cathode conducting layer as well as the anode conducting layer and other electric power sources can be realized by extending the down-lead plate.

Description

technical field [0001] The invention relates to a field emission display, in particular to a wire arrangement structure of a field emission display with a packaging frame. Background technique [0002] In recent years, due to the excellent electron generation efficiency of carbon nanotubes, they are often used as cathode electron emission sources in field emission flat panel displays. Compared with other types of flat panel displays, field emission flat panel displays are more mature. They not only have better brightness and wide viewing angles, but also have the advantages of low power consumption and fast response speed. [0003] The current common field emission flat panel display structure is usually composed of a cathode plate and an anode plate, wherein the cathode plate and the anode plate have a cathode substrate and an anode substrate respectively, and a packaging frame structure is set between the cathode and anode substrates to block and form an internal vacuum ar...

AI Technical Summary

Problems solved by technology

Although this method is relatively simple in process and does not need to provide an additional mating area, which improves the material loss of the aforementioned method, the diameter of the electrode wire made of solid metal is thicker than that formed by the general screen printing process. Therefore, it is not conducive to the configuration of high-resolution complex multi-set electrode wires, and when these solid metal electrode wires pass through the packaging structure between the male and female substrates, due to the difference in structural materials, it is not easy to be closely connected with the substrate and easily form fine seams, resulting in air leakage. Affects the internal vacuum environment

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