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Chip identification production method and light shield

A technology of chip identification and production method, which is applied in the fields of photolithography, optics, semiconductor/solid-state device manufacturing, etc. on the pattern surface, and can solve problems such as inability to restore, inability to determine the status of the wafer, etc.

Inactive Publication Date: 2009-12-30
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The problem to be solved by the present invention is to provide a method for making a chip mark and a photomask to prevent the chip from being restored to its original position on the wafer after testing, and the situation of the entire wafer cannot be determined.

Method used

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  • Chip identification production method and light shield
  • Chip identification production method and light shield
  • Chip identification production method and light shield

Examples

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Embodiment Construction

[0024] The invention determines the chip identification pattern corresponding to the chip one by one, and the chip identification pattern can be on the photomask; the chip identification pattern is transferred to the chip cutting protection ring of the wafer to form the chip identification. In this way, after the chip is tested, the original position of the chip on the wafer can be known according to the mark on the chip, so as to determine the quality of the entire wafer, and then in the subsequent chip manufacturing process, attention can be paid to the position where defects occur for improvement. In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] The invention provides a method for making a chip mark, comprising the following steps: determining a chip mark pattern corresponding to a...

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Abstract

The invention provides a fabrication method of a chip label, and a photomask, comprising the steps as follows: chip label images corresponding to the chips one by one are determined; the chip label images are transferred on a chip cutting protecting ring of a wafer, so as to form a chip label. By the steps, the position of the chip at the wafer is determined according to the label on the chip, thus determining the mass of the whole wafer.

Description

technical field [0001] The invention relates to the field of manufacturing and testing of semiconductor devices, in particular to a manufacturing method and a photomask of a chip mark of a semiconductor device. Background technique [0002] In semiconductor manufacturing technology, many processes are usually required to complete semiconductor products, such as photolithography process, etching process, ion implantation process, etc.; in these processes, a large number of machines and many tedious procedures must be applied. Therefore, those skilled in the art are committed to ensuring the normal operation of the machine, maintaining or improving the product qualification rate, detecting and confirming problems, and machine maintenance, so that the production speed and quality of semiconductor products can meet customer needs. [0003] Generally speaking, to discuss the problems of semiconductor process, we can start to analyze the following data, including process parameter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00G03F1/14G03F1/00
Inventor 张步新王媛
Owner SEMICON MFG INT (SHANGHAI) CORP