Module with chip connection contact, its data carrier and lead frame structure

A technology for connecting contacts and data carriers, applied to record carriers used in machines, electric solid-state devices, semiconductor devices, etc.

Inactive Publication Date: 2010-02-24
NXP BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Thus, the known designs have significant limitations, namely because they are only suitable for modules and the chips contained within such modules with a single other element having two element connection contacts, i.e. a transmission coil with two coil connection contacts Working together, in the case of a known design, the two module connection plates are contact-connected in a non-exchangeable manner only with the connection contacts of these two components, wherein this connection is in common with other components, namely the transmission coil and the module connection plate and Polarity-independent connection with chip connection contacts

Method used

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  • Module with chip connection contact, its data carrier and lead frame structure
  • Module with chip connection contact, its data carrier and lead frame structure
  • Module with chip connection contact, its data carrier and lead frame structure

Examples

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Embodiment Construction

[0026] figure 1 Module 1 is shown. The module 1 is designed in the form of a plate and has as low an overall height as possible: in this case approximately 220 μm. The overall height may range between 190 μm and 400 μm. The module 1 includes a leadframe structure 2 and a chip 3 . The chip 3 includes a circuit (not shown), with the aid of the circuit, it can perform contactless communication with a communication base station suitable for the circuit. Chip 3 has chip connection contacts 4 , 5 and 6 , 7 . We will explore the purpose of connecting contacts 4 to 7 in further detail below.

[0027] The module 1 and the leadframe structure 2 have a midpoint 8 and a main axis 9 passing through the midpoint 8 and a secondary axis 10 likewise passing through the midpoint 8 .

[0028] The module 1 is intended for use in a data carrier 11 designed for contactless communication. exist figure 2 A data carrier 11 is shown in . As an electronic component, the data carrier 11 contains...

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PUM

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Abstract

In the case of a module (1) for a data carrier (11) designed for contactless communication, the module (1) has a chip (3) with at least two pairs (20, 21) of chip connection contacts (4, 5, 6, 7) andwith at least two pairs (22, 23) of module connecting plates (24, 25, 26, 27), wherein in a starting position, the shapes of the plate surfaces of the module connecting plates (24, 25, 26, 27) resultin a particular plate pattern, and differ with regard to the shape of the plate surfaces such that when all the module connecting plates (24, 25, 26, 27) are rotated around a mid-point (8) of the module (1), the same plate pattern results respectively after 180 DEG .

Description

technical field [0001] The invention relates to a module with a chip with chip connection contacts, the module having a center point, which is conceived for use in a data carrier designed for contactless communication, which data carrier contains a chip with chip connection contacts Module of the chip, furthermore comprising at least one further electronic component with component connection contacts, which is electrically conductively connected to the chip, wherein an electrically conductive connection between the chip and the at least one further component can be achieved according to two opposite polarities. [0002] The invention also relates to a data carrier designed for contactless communication, comprising a module having a chip with chip connection contacts and also comprising at least one other electronic component with component connection contacts, which are conductively connected to the chip . [0003] The invention also relates to a leadframe structure intended ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
CPCG06K19/0775H01L2924/0002G06K19/07745G06K19/07749G06K19/07743H01L2924/00
Inventor P·胡伯J·肖伯
Owner NXP BV
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