Rear panel module for heat radiator

Abstract

A heat radiator back board module can be used for heat resource which heat radiator is fixed on host board, wherein the heat resource is provided with a plurality of positioning holes around. The back board module comprises a plate and a plurality of positioning posts, wherein the plate is under a host board, provided with a plurality of locking holes, while each locking hole is provided with an internal screw inside. Part of the locking holes is relative to a plurality of positioning holes on the host board. And the positioning posts are assembled in part of the locking holes relative to thepositioning holes. One end of each positioning post is provided with an external screw to be locked on the internal screw of relative locking hole.

Description

Radiator Backplane Module technical field The present invention relates to a backing plate module (BackingPlateModule), and in particular to a heat sink backing plate module (HeatSinkBackingPlateModule). Background technique With the rapid development of the electronic industry, the calculation speed of electronic components such as the Central Processing Unit (CPU) has been greatly increased, and the heat generated by it has also increased dramatically. Therefore, the industry often arranges a heat sink (HeatSink) on the CPU on the motherboard (MotherBoard) to reduce the internal operating temperature of the CPU. In order to meet the heat dissipation requirements of the CPU, the size and weight of the heat sink disposed on the CPU tend to increase gradually. In order to avoid deformation of the main board due to the downward pull force generated by the weight of the radiator when the main board is in a high temperature state for a long time, the main board is prone to b...

AI Technical Summary

Problems solved by technology

It is worth mentioning that the design specifications of most radiator backplanes on the market only conform to the specifications of the mainboards they are matched with. That is to say, the backplanes with the guide post function on the market are all single-specification backplanes and cannot be used for common use. For functions above the second specification, for example: the Intel mount will have a corresponding back plate, the K8 mount will have a corresponding back plate, and the back plate that is suitable for the Intel mount cannot be used for the back plate of the K8 mount.

Therefore, when users want to change motherboards with different specifications (for example, from Socket478 motherboards to LGA775 motherboards), they need to purchase additional backplanes that meet the specifications of another motherboard, resulting in waste

In addition, the guide posts of the backplanes with the guide post function on the market are fixed, and the guide posts are usually riveted or embedded into the backplane. This design principle cannot be shared with other specifications of motherboards.

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