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Heating device for wall, ceiling or floor coverings

A covering and ceiling technology, applied in the field of heating equipment, can solve the problems of slow response of heating devices

Active Publication Date: 2010-07-07
LIGNUM TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, the reaction of this heating device is relatively slow

Method used

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  • Heating device for wall, ceiling or floor coverings
  • Heating device for wall, ceiling or floor coverings
  • Heating device for wall, ceiling or floor coverings

Examples

Experimental program
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Embodiment Construction

[0051] Hereinafter, the present invention will be described in more detail with reference to specific exemplary embodiments.

[0052] figure 1 Shown is a heating device comprising heating wires 1 arranged parallel to each other in a network, net or net-like structure. The non-conductive wire 2 is perpendicular to the heating wire 1 and is interwoven with it. In this way, a two-dimensional arrangement is provided that is easy to process and can be integrated into a panel. For example, a highly conductive part 3 is produced by a metal coating, which is parallel to the non-conductive wire 2 and is electrically connected to the heating wire 1 . A plurality of non-conductive wires 2 are always between electrically good conductor parts 3 .

[0053] In order to use such a heating device during the manufacture of the laminate, the distance between the electrically conductive parts 3 is typically between 1 and 40 cm. These distances apply to panels with rectangular surfaces having ...

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PUM

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Abstract

The invention relates to a heating device and in particular, an element of a floor heating device. Known floor heating devices comprise heating means which are arranged underneath a floor covering, for example, below stone plates, tiles, parquet elements or laminated panels. Said heating means can be made of electrically heatable films which are arranged close to the surface of a covering in order to directly heat a room.

Description

technical field [0001] The invention relates to heating installations, and in particular the invention relates to elements of floor heating installations. Background technique [0002] Floor heating installations are known which comprise a heating device arranged beneath a floor covering, for example beneath stone slabs, tiles, parquet floor units or laminate. The heating device may comprise a heater. [0003] In the prior art described above, the generated heat must first pass through the slates, tiles, parquet units or laminates before the house can be heated in the desired manner. On the one hand, the response of such heating devices is relatively slow. On the other hand, a relatively large amount of heat is undesirably transferred to the floor. Contents of the invention [0004] The object of the present invention is to provide a heating element with which a good heating effect can be achieved. [0005] To achieve the above objects, the floor element comprises heat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B3/28F24D13/02
CPCH05B3/28Y02B30/00
Inventor 戴尔特·多瑞恩海因茨·索恩哥哈德·克瑞姆戴维·马谢
Owner LIGNUM TECH AG