Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat radiating device

A technology of heat sink and radiator, applied in cooling/ventilation/heating transformation, instrument cooling, instrument and other directions, can solve the problems of affecting the service life of the motherboard, heating up the motherboard, and not taking into account the transistors and other problems

Inactive Publication Date: 2008-01-30
FU ZHUN PRECISION IND SHENZHEN +1
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are many transistors around the central processing unit on the computer motherboard. These transistors can supply power to the central processing unit. When the computer is running, these transistors will also generate a lot of heat. The heat transfer to the main board will cause the main board to heat up and affect the temperature of the main board. Motherboard Lifespan
[0004] However, the cooling device placed on the CPU of the circuit board can only dissipate heat from the CPU and does not take into account the transistors around it.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat radiating device
  • Heat radiating device
  • Heat radiating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] Please refer to FIG. 1 and FIG. 2 , which are a heat dissipation device according to Embodiment 1 of the present invention. The heat dissipation device shown is installed on a circuit board 90, and is used for simultaneously controlling a first heat-generating electronic component (a central processing unit 92 in this embodiment) and a second heat-generating electronic component (a transistor 94 in this embodiment) ) heat dissipation, the CPU 92 is fixed on the circuit board 90 through a socket connector 95 . The heat dissipation device mainly includes a heat dissipation module 10 , two fasteners 50 and a heat dissipation component 60 .

[0013] The heat dissipation module 10 includes a heat conducting plate 40 , a heat sink 30 placed on the heat conducting plate 40 and two heat pipes 20 accommodated in the heat sink 30 and the heat conducting plate 40 .

[0014] The heat conduction plate 40 is arranged in a rectangular shape, and two semicircular grooves 426 in cross-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A cooling device comprises a radiator, the radiator is contacted with a first heating electronic component, a second heating electronic component is arranged around the first heating electronic component, the bottom of the radiator and the top of the second heating electronic component form a space, a cooling component is clamped between the second heating electronic component and the bottom of the radiator, the heat of the second heating electronic component is conducted to the radiator. The cooling device facilitates the second heating electronic component (transistor) and the radiator to be contacted and connected with each other by heating a cooling component and can also give attention to the cooling of the second heating electronic component.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device capable of dissipating heat from a plurality of electronic components. Background technique [0002] With the rapid development of the electronic industry, the calculation speed of the electronic components in the computer has been greatly increased, and the heat generated by it has also increased sharply. How to dissipate the heat of the electronic components to ensure their normal operation has always been a must for the industry. question. As we all know, the central processing unit installed on the motherboard is the core of the computer system. When the computer is running, the central processing unit generates heat. Excessive heat can prevent the CPU from functioning properly. In order to effectively dissipate the heat generated by the CPU during operation, a cooling device is usually installed on the CPU of the circuit board to dissipate the generate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20H01L23/367G12B15/00G06F1/20
Inventor 刘金標翁世勋余光陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN