An evaporation cavity heat radiator

Abstract

The invention relates to a steam cavity radiator, which is attached to a heating element and dissipates the heat energy generated by the heating element through liquid-gas phase change. The steam chamber radiator has a cover, a heat dissipation base attached to the heating element, and heat-conducting powder, wherein the cover is joined to the heat dissipation base and forms a closed accommodating space between the two to accommodate the liquid-gas phase change. For heat dissipation liquid, the inner surface of the heat dissipation base facing the accommodating space has a raised portion corresponding to the heating element, and the above-mentioned heat-conducting powder is arranged on this surface to form a capillary space. There are more powders than other layout areas, so more capillary space is provided to more effectively use capillary phenomenon for heat transfer and improve heat dissipation effect.

Description

technical field [0001] The invention relates to a steam cavity radiator, in particular to a steam cavity radiator in which capillary space is added around a heat source in the cavity to effectively utilize capillary phenomena to improve heat dissipation efficiency. Background technique [0002] Please refer to FIG. 1 , which is a schematic structural diagram of a general steam cavity radiator. According to the current steam cavity radiators on the market, there must be a cavity 112 to accommodate the heat dissipation liquid 114 that dissipates heat energy through the change of liquid and gas phases, and the side of the cavity 112 corresponding to the heating element 120 is usually It is a plane, evenly spread the heat conduction powder 113, and sinter it on this plane. The sintered heat-conducting powder 113 forms a plurality of capillary spaces for accommodating the cooling liquid 114 . In other words, the cooling liquid 114 infiltrates between the heat-conducting powders ...

AI Technical Summary

Problems solved by technology

[0004] However, the previous technology has the following unavoidable disadvantages, that is, the thickness of the heat conduction powder easily affects the heat dissipation effect of the heat dissipation liquid, which includes:

[0005] 1. If the thickness of the heat-conducting powder is too thin, the capillary space formed will be too scarce to accommodate too much heat dissipation liquid. This will cause when the heat dissipation liquid absorbs heat and forms a gaseous state, other liquid heat dissipation liquids will It is impossible to quickly fill the vacancy in the capillary space through the action of capillary phenomenon, which will hinder the conduction of heat energy and cause the heat energy to fail to dissipate quickly

[0006] 2. If the heat-conducting powder is spread too thickly, the heat-conducting powder will become too dense after sintering, and the cooling liquid cannot penetrate into the capillary space at the bottom of the heat-conducting powder, so that the heat energy cannot be conducted to the cooling liquid, resulting in the inability to dissipate heat through The liquid dissipates heat

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