Unlock instant, AI-driven research and patent intelligence for your innovation.

Differential i/o spline for inexpensive breakout and excellent signal quality

A spline and differential technology, applied in the direction of test/measurement connectors, line/collector components, coupling devices, etc., can solve problems such as insufficient ground return path, high price, high-speed signal signal quality affecting performance, etc.

Inactive Publication Date: 2010-12-08
INTEL CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as mentioned above, as the number of signals increases, maintaining the same signal-to-ground ratio can lead to prohibitively expensive oversized packages
However, the signal quality of high-speed signals can potentially affect performance if the signal pins are isolated and they do not have adequate return paths to ground

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Differential i/o spline for inexpensive breakout and excellent signal quality
  • Differential i/o spline for inexpensive breakout and excellent signal quality
  • Differential i/o spline for inexpensive breakout and excellent signal quality

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In the following description, numerous specific details are set forth, such as examples of sockets, I / O signaling conductors, integrated circuits, packaging techniques, etc., in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without employing these specific details. In other instances, well-known components or methods, such as fabricating integrated circuits, packaging integrated circuits, forming I / O terminals, pins or contacts, have not been described in detail in order not to unnecessarily obscure the present invention. , and specific slot retention mechanisms.

[0022] The methods and apparatus described herein are to provide cost-effective I / O terminal and / or slot layouts. However, the methods and apparatus for configuring I / O terminals / slots are not limited thereto, and they can be implemented on any integrated circuit that requires bumps, pads...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A apparatus is described herein for configuring Input / Output (I / O) conductors on an integrated circuit (IC) or in a socket. At least a portion of the I / O conductors for an IC and / or contacts / receptacles of a socket are configured in a repeatable 2x4 rectangular T pattern. The rectangular T pattern includes a first line of four conductors, which include two ground conductors and a first differential pair of conductors, and a second line of four conductors, which include a second and a third pair of differential conductors. The I / O conductors on the IC may be pads / lands in an land-grid-array (EGA) style socket, pins in a pin-grid-array (PGA) style socket, or other conductor in another style of socket, while the socket includes corresponding contacts, receptacles, etc.

Description

technical field [0001] The present invention relates to the field of coupling integrated circuits to circuit boards, and in particular, to I / O signals and socket configurations. Background technique [0002] Computer systems have rapidly become central to many operations employed in homes around the world. Previously, computers were used for simple computing operations; however, the application of computers has evolved from this simple model to an electronic device hub. Some examples of this advancement include the use of computers as media centers, TVs, stereo systems, and picture libraries. As a result, the amount of internal logic and the need for more input / output (I / O) terminals for communication with external devices has rapidly increased. [0003] However, as the speed of interconnects such as front-side buses (FSBs) continues to increase to ensure sufficient bandwidth for integrated circuits such as microprocessors, signal integrity is becoming an increasing concer...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01R33/76H01R11/01H01R11/03H01R12/71H01R33/97H01R12/22
CPCH01R12/523H01R13/24H01R2201/20H01R43/0249
Inventor G·达利D·维利斯
Owner INTEL CORP