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Element fixing apparatus

A technology for installing devices and components, applied in the direction of electrical components, electrical components, etc., can solve problems such as the decrease of operating rate, and achieve the effects of avoiding wrong stops, improving production efficiency, and suppressing the decrease of operating rate

Active Publication Date: 2008-04-09
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the centralized control type component mounting apparatus as described above, there is a problem that, for example, if any one of the plurality of unit mounting machines stops due to an error, the entire device cannot be prevented from eventually stopping due to an error. Significantly reduces the operating rate when an error occurs

Method used

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  • Element fixing apparatus
  • Element fixing apparatus
  • Element fixing apparatus

Examples

Experimental program
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Embodiment Construction

[0021] 1 and 2 show the appearance of a component mounting device 1 according to an embodiment of the present invention. In the component mounting apparatus 1 shown in FIGS. 1 and 2 , four unit mounters 3 to 6 (module mounters (Module Mounter)) are arranged inside a case 7 constituting its outer shape. Upper covers 9, 9, . With these upper covers 9, 9, .

[0022] The component mounting process on the board|substrate P (refer FIG. 3 etc.) is performed sequentially in each said unit mounter 3-6. Component mounting on the substrate P is performed in the order of the unit mounters 3, 4, 5, and 6. That is, the +X direction in the figure is the upstream side, and the -X direction is the downstream side, and the component mounting process is sequentially performed from the unit mounter closer to the upstream side, ie, closer to the +X direction. The details will be described later.

[0023] The above-described component mounting apparatus 1 is arranged as a part of a mounting lin...

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PUM

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Abstract

The component mounting apparatus (1) of the present invention includes a plurality of unit mounting machines (3) to (6) for mounting electronic components on a substrate P; and between the plurality of unit mounting machines (3) to (6) A substrate conveying mechanism (8) for conveying the substrate P; by collectively controlling the above-mentioned each unit mounting machines (3)-(6) and the substrate conveying mechanism (8), the substrate P is placed on each unit mounting machine (3)-(6) A centralized control device (60) that moves between each unit mounting machine (3)-(6) to perform mounting processing on the substrate in sequence; any one of the above-mentioned multiple unit mounting machines (3)-(6) installs An individual restart instructing device (10) for instructing the unit mounting machine to restart the mounting process when the machine stops due to an error. According to the present invention, it is possible to suppress a drop in operating rate when an error occurs, and further improve production efficiency.

Description

technical field [0001] The present invention relates to a component mounting apparatus including a plurality of unit mounters for performing component mounting processing on a substrate. Background technique [0002] Conventionally, there is known a mounting machine comprising a component supply unit for supplying electronic components and a head unit having a suction head for attracting components, etc., wherein the electronic components supplied by the component supply unit are sucked by the head unit, and the The electronic components are mounted on the substrate. [0003] Recently, a multi-unit mounting machine (module mounting machine) as shown in Patent Document 1 (Japanese Patent Laid-Open Publication No. 3596295) has been developed in response to the need to increase the speed of mounting work and adaptability to type changeover. A multi-unit type component mounting device that performs component mounting processes in a distributed manner. That is, in this multi-un...

Claims

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Application Information

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IPC IPC(8): H05K13/04
Inventor 三宅祥史
Owner YAMAHA MOTOR CO LTD