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Contact probe for a testing head having vertical probes for semiconductor integrated electronic devices

A test head and probe technology, applied in the field of contact probes, can solve problems such as limited distance

Inactive Publication Date: 2008-04-09
EXPLORATION OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0033] - The distance between two adjacent probes of the test head 1 is limited due to the circular cross-section of the wires that make contact with the probes 6

Method used

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  • Contact probe for a testing head having vertical probes for semiconductor integrated electronic devices
  • Contact probe for a testing head having vertical probes for semiconductor integrated electronic devices
  • Contact probe for a testing head having vertical probes for semiconductor integrated electronic devices

Examples

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Embodiment Construction

[0061] With reference to these drawings and in particular to FIGS. 8A to 8D , a contact probe according to the invention is indicated at 20 .

[0062] The contact probe 20 has a rod-shaped body 21 equipped with at least one contact tip or tip 22 . Specifically, as seen with reference to the prior art, the contacts 22 are in mechanical contact with the contact pads of the integrated electronic device to be tested, while said integrated electronic device is in electrical contact with test equipment (not shown), the test The head is the terminal element of the test equipment.

[0063] Furthermore, for example in the case of probes for a test head with unblocked probes, the contact probes 20 have, in relation to microcontact strips or space transformers, a plurality of contact pads facing the space transformer (spacetransformer). The second contact 23.

[0064] It is advantageous according to the invention that the rod-shaped body 21 of the contact probe 20 has a non-uniform cro...

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PUM

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Abstract

A contact probe (20) for a tasting head is described, of the type wherein a plurality of these probes are inserted in guide holes realised in respective dies, the probe comprising a rod-shaped body (21) equipped at an end with at least a contact tip (22) effective to ensure the mechanical and electrical contact with a corresponding contact pad of an integrated electronic device to be tested. Advantageously, the rod-shaped body (21) has a non uniform cross section. Moreover, a testing head and a method for obtaining the contact probe according to the invention are described.

Description

technical field [0001] The present invention relates to a contact probe for a test head having vertical probes for efficiently testing a plurality of semiconductor integrated electronic devices including a plurality of so-called contact pads. [0002] More particularly, the present invention relates to a contact probe for a type of test head in which a plurality of probes are inserted into guide holes formed in corresponding plate-like holders or plates Inside, the probe comprises a rod-shaped body equipped at one end with at least one contact effectively ensuring mechanical and electrical contact with corresponding contact pads of the integrated electronic device to be tested. [0003] The invention also relates to a method for obtaining such a contact probe, and a test head comprising a plurality of said probes. [0004] The present invention particularly but not exclusively relates to a test head having vertical probes for testing semiconductor integrated electronic device...

Claims

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Application Information

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IPC IPC(8): G01R1/067G01R1/073
CPCG01R1/06711G01R1/07357G01R1/06733
Inventor 朱塞帕·克里帕斯特法诺·费利奇
Owner EXPLORATION OF TECH