Method for fine line resist stripping

A photoresist, solution technology, applied in optics, instruments, optomechanical equipment, etc., can solve the problems of unsatisfactory solvent-based strippable photoresist, expensive waste disposal and environmental problems

Inactive Publication Date: 2008-05-21
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While these organic strippers such as triethylamine or tetramethylammonium hydroxide solutions are better at removing resist, they are expensive (relative to NaOH or KOH) and have more waste disposal and environmental c

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0049] Example 1 (comparison):

[0050] Sample A was sprayed with a solution consisting of 30 g / l KOH in water at 60° C. for 1 minute at 1.5 bar. Some of the resist coating was partially stripped from the sample into the stripper solution in the form of flakes. After washing and drying, the samples were studied with a fluorescence microscope at 200X magnification. As a result, Sample A showed resist residues everywhere. The stripping results were unsatisfactory. Additional processing steps in series are required to remove at least most of the resist film on the surface of the board. Even so, stripping is not complete.

example 2

[0051] Example 2 (comparison):

[0052] Spray coating with a solution consisting of 30 g / l monomethanolamine, 5 g / l tetramethylammonium hydroxide and 5 g / l choline hydroxide and 0.5 g / l benzotriazole in water at 60 °C at 1.5 bar Sample A 1 minute. The resist was stripped from the sample into solution as 4-5 mm particles. After washing and drying, the samples were studied with a fluorescence microscope at 200X magnification. As a result, Sample A showed some resist residue particles left in the lift-off area and a good copper surface appearance pattern. However, the stripping results were not satisfactory. Additional processing steps in series are required to remove at least most of the resist film on the surface of the board. Even so, stripping is not complete.

example 3

[0054] Sample B was sprayed in a first step with a solution consisting of 30 g / l KOH in water at 60° C. at 1.5 bar for 1 minute. Thereafter, in a second step, the sample A1 min was sprayed with a solution consisting of 30 g / l KOH and 100 ml / l diethylene glycol monobutyl ether in water at 60° C. at 1.5 bar. In the first step, the resist was stripped from Sample B into the stripper solution in the form of sheets and in the form of 0.5-1 mm particles into the stripper solution in the second step. After washing and drying, the samples were studied with a fluorescence microscope at 200X magnification. As a result, Sample A showed no resist residue in the lift-off area and a good copper surface appearance. The stripping results should be considered pole pieces.

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Abstract

The invention relates to a 2-step stripping process comprising the following stripping steps: a) treating the substrate with an aqueous solution containing a base, b) thereafter further treating the substrate with a solution containing a base and at least one stripping enhancer selected from the group consisting of hexylene glycol, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol monoisopropyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monopropyl ether, triethylene glycol monobutyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol monopropyl ether, tripropylene glycol monobutyl ether, diethylenglycolmonoisopropyl ether and propylene glycol monomethyl ether acetate.

Description

technical field [0001] The present invention relates to a method of stripping dry films and photoresist materials from substrates. The substrate is typically a semiconductor device or a printed circuit board. Background technique [0002] Integrated circuit fabrication techniques photolithographically outline patterns on substrates using positive photoresist-type materials that are etched later in the process by wet or dry etching techniques. [0003] Imaging is the process of patterning metal conductors to form circuits. This process involves multi-step integration of imaging materials, imaging equipment, and processing conditions using metallization methods to reproduce the original pattern (master pattern) on the substrate. Large features (200 μm and above) can be formed very economically by screen printing. However, feature sizes smaller than 200 μm have to be formed using photolithographic methods. As circuit densities have increased over the years, imaging methods ...

Claims

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Application Information

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IPC IPC(8): G03F7/42
CPCG03F7/425G03F7/30
Inventor 克里斯蒂安·斯帕林迪莱克·特伍思尼尔·伍德
Owner ATOTECH DEUT GMBH
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