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Radiator combination

A technology of radiator and main radiator, applied in radiator combination. It can solve the problems of the motherboard heating up, affecting the service life of the motherboard, and not taking into account the central processing unit and transistors at the same time.

Inactive Publication Date: 2011-06-29
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] There are many transistors around the central processing unit on the computer motherboard. These transistors can supply power to the central processing unit. When the computer is running, these transistors will also generate a lot of heat. The transistors transfer the heat to the main board, causing the main board to Temperature rises, which in turn affects the service life of the motherboard
[0004] However, the design of existing heat sinks is only for dissipating the heat generated by the central processing unit, and cannot take care of the central processing unit and transistors at the same time; at the same time, as computers are becoming more and more sophisticated and smaller and smaller, thus , to simultaneously solve the heat dissipation problem of the central processing unit and its surrounding transistors in a limited space has become a problem that the industry needs to solve

Method used

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  • Radiator combination
  • Radiator combination
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Embodiment Construction

[0014] figure 1 A radiator assembly is disclosed, which is installed on a circuit board 80. The circuit board 80 has a CPU 82 in the center, and a pair of transistors 84 adjacent to the CPU 82. The radiator assembly is used for simultaneously The central processing unit 82 and the transistor 84 are dissipated.

[0015] The heat sink assembly includes a main heat sink 10 for cooling the CPU 82 and an auxiliary heat sink 20 for cooling the transistor 84 .

[0016] see figure 2 The main heat sink 10 includes a base 12 , a plurality of cooling fins 14 placed on the base 12 , and a pair of heat pipes 16 connecting the base 12 and the cooling fins 14 . A pair of locking elements 18 are placed on the bottom of the main heat sink 10 to cooperate with the base 12 to fix the main heat sink 10 to the circuit board 80 .

[0017] The base 12 is a metal plate with high thermal conductivity, arranged in a roughly rectangular shape and in contact with the CPU 82 . The top of the base 12 ...

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Abstract

The invention relates to a radiator combination, which comprises a main radiator and an assisting radiator which is provided with a heat absorbing plate and a shrapnel pushing against between the heat absorbing plate and the main radiator. The radiator combination is not only provided with the main radiator to cool a central processor but also provided with the assisting radiator to cool the electronic components surrounding the central processor. After the main radiator is fixed, the assisting radiator cools the electronic components through jointing in an abutting way to the shrapnel further pressing in the electronic components.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a radiator combination used on electronic components. Background technique [0002] With the rapid development of the electronic industry, the computing speed of the electronic components in the computer has been greatly increased, and the heat generated by it has also increased sharply. How to dissipate the heat of the electronic components to ensure their normal operation has always been a must for the industry. The problem. As we all know, the central processing unit installed on the motherboard is the core of the computer system. When the computer is running, the central processing unit generates heat. Excessive heat can prevent the CPU from functioning properly. In order to effectively dissipate the heat generated by the CPU during operation, a cooling device is usually installed on the CPU of the circuit board to dissipate the generated heat. [0003] There are many transisto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20H01L23/427
Inventor 刘金标余光翁世勋陈俊吉
Owner FU ZHUN PRECISION IND SHENZHEN