Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Full-chip interconnecting line power consumption optimum layout stage buffer planning method

An interconnection and buffer technology, applied in the field of interconnection design optimization, can solve the problems of increasing the complexity of power network design, random distribution of low-voltage modules, and inability to directly transplant.

Inactive Publication Date: 2008-08-13
TSINGHUA UNIV
View PDF0 Cites 25 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the module power optimization models in these algorithms are based on multi-supply voltage technology, and the use of this method has relatively large limitations: on the one hand, multi-supply voltages will bring additional level conversion circuit overhead, and in a given layout In some cases, these algorithms will cause random distribution of low-voltage modules, which greatly increases the design complexity of the power network
Since the relationship between module power consumption and time slack is different from the relationship between interconnect power consumption and time slack, these time slack allocation algorithms for module power optimization cannot be directly transplanted to interconnect power optimization
Therefore, so far, there is no effective method to effectively allocate the amount of time slack to obtain the optimal total power consumption of interconnect lines

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full-chip interconnecting line power consumption optimum layout stage buffer planning method
  • Full-chip interconnecting line power consumption optimum layout stage buffer planning method
  • Full-chip interconnecting line power consumption optimum layout stage buffer planning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0115] This part takes n30 in the international benchmark test circuit example GSRC as an example, adopts .18um process parameters, and explains the present invention according to the steps described above.

[0116] The following table shows the definitions and values ​​of some process-related parameters:

[0117] Table 1: List of Process Parameters

[0118] r

Wire resistance per unit length (Ω / μm)

0.008

c

Line capacitance per unit length (fF / μm)

0.269

V DD

Power supply voltage (V)

1.8

f clk

Working frequency(GHz)

1.2

c 0

Buffer Input Capacitance per Unit Size (fF)

1.9

r s

Unit Size Buffer Output Resistance (Ω)

36300

c p

Buffer Output Capacitance per Unit Size (fF)

4.8

I offn

Buffer leakage current per unit size (uA)

0.2

I short

Snubber short-circuit current per unit size (uA)

65

R d

Dri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an approaches to planning of chip interconnection line power-optimized layout stage buffer, belonging to interconnection line design optimization field of technology, characterized in containing follow steps: reading module information and interconnection line information, establishing circuit logical topology, initializing side state being 1, calculating time relaxation measurement between the module interconnection lines, calculating each side weighing in the logical topology, obtaining maximal cut set of the logical topological diagram by pre-flowing boost method, distributing time relaxation measurement to each side of the cut set, for each interconnection line, calculating need buffer size and numbers and total interconnection lines power dissipation according to the distribution result of the time relaxation. The invention reduces total power dissipation of the interconnection line without sacrificing circuit time lag performance, having great executing efficiency and industrial application price.

Description

technical field [0001] A buffer planning method for optimal power consumption of a full-chip interconnect line in the layout stage belongs to the field of computer-aided design of integrated circuits, and in particular relates to the field of design optimization of interconnect lines. Background technique [0002] With the continuous shrinking of the integrated circuit process size and the continuous improvement of the integration level, the delay of the interconnection line has greatly affected the performance of the circuit. In order to improve the delay of the interconnect, it is generally necessary to use buffers in the global interconnect. However, these buffers greatly increase power consumption, making interconnect power consumption a significant component of overall chip power consumption. Optimization of interconnect power consumption has become an important consideration in circuit design. [0003] The performance of a circuit depends on the slowest path (the cri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F17/50
Inventor 马昱春贺祥庆洪先龙蔡懿慈邱翔
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products