Full-chip interconnecting line power consumption optimum layout stage buffer planning method
An interconnection and buffer technology, applied in the field of interconnection design optimization, can solve problems such as increasing the complexity of power network design, inability to directly transplant, and random distribution of low-voltage modules.
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[0117] This part takes n30 in the international benchmark test circuit example GSRC as an example, adopts .18um process parameters, and explains the present invention according to the steps described above.
[0118] The following table shows the definitions and values of some process-related parameters:
[0119] Table 1: List of Process Parameters
[0120] r Wire resistance per unit length (Ω / μm) 0.008 c Line capacitance per unit length (fF / μm) 0.269 V DD Power supply voltage (V) 1.8 f clk Working frequency(GHz) 1.2 c 0 Buffer Input Capacitance per Unit Size (fF) 1.9 r s Unit Size Buffer Output Resistance (Ω) 36300 c p Buffer Output Capacitance per Unit Size (fF) 4.8 I offn Buffer leakage current per unit size (uA) 0.2 I short Snubber short-circuit current per unit size (uA) 65 R d Drive output resistance (Ω) 400 C L Load Capacitance (fF) 200
[0121]1. Establish a piecewise linear...
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