Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same
A technology of sealant and sealing area, applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve the problems of optical loss and no reflection
Active Publication Date: 2008-10-01
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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- Description
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- Application Information
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Problems solved by technology
While reflective cups may direct light in an upward direction, optical losses may occur when light is reflected (i.e., some light may be absorbed by the reflector cup and not reflected)
Method used
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[0041] The present invention will now be described more fully with reference to the accompanying drawings in which embodiments of the invention are shown. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In these figures, the size and relative sizes of layers and regions may be exaggerated for clarity. Like reference numerals refer to like elements throughout.
[0042] It will be understood that when an element such as a layer, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. It will be understood that if a portion of an element, such as a surface, is referred to as "inner," it is further from the exterior of the device t...
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A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
Description
technical field [0001] The invention relates to a semiconductor light-emitting device and a method for preparing the semiconductor light-emitting device, and more particularly relates to packaging and a packaging method for the semiconductor light-emitting device. Background of the invention [0002] Light emitting diodes and laser diodes are well known solid-state electronic devices capable of producing light upon application of sufficient voltage. Light emitting diodes and laser diodes may generally be referred to as light emitting devices ("LEDs"). Light emitting devices typically include p-n junctions formed on epitaxial layers grown on substrates such as sapphire, silicon, silicon carbide, gallium arsenide, and the like. The wavelength distribution of light produced by the LED generally depends on the material from which the p-n junction is made and the structure of the thin epitaxial layers that make up the active region of the device. [0003] Typically, an LED incl...
Claims
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IPC IPC(8): H01L33/00H01L33/48H01L33/52H01L33/54
CPCH01L2933/005H01L33/52H01L33/486H01L2224/32225H01L33/54H01L2224/32245H01L2224/48091H01L2924/10253H01L2224/48227H01L2224/73265H01L2224/48247H01L2924/00014H01L2924/00H01L2924/00012H01L33/48
Inventor P·安德鲁斯
Owner CREELED INC (N D GES D STAATES DELAWARE NEWARK)