Printed circuit board and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, circuits, and printed electrical components, and can solve problems such as miniaturization, high density, and large area occupied by coil components, and achieve components Effects of reduced mounting area and stable manufacturing

Inactive Publication Date: 2011-07-06
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, in this method, the area occupied by each built-in coil element is also large, which does not meet the requirements for miniaturization and high density, and the problem cannot be solved.

Method used

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  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof
  • Printed circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] figure 1 (1) to (4) are explanatory diagrams showing the basic structure of the planar coil and its electromagnetic action. in figure 1 (1) is a schematic diagram of a planar coil in which a wiring pattern is formed in a spiral shape. Once the current I flows into the coil, the helical current forms a magnetic field, and the magnetic flux φ proportional to the current I passes through the center of the coil. If the magnetic flux passing through the coil changes with time, a back electromotive force V proportional to the number N of turns of the coil is generated in the helical wiring pattern accordingly (Expression 1). Formula 1) V = - N dφ dt

[0029] Since the magnetic flux φ is proportional to the current I, the above formula 1 is expressed as the following formula 2 using the proportionality constant L. Formula 2) V = - N dφ ...

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PUM

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Abstract

The invention relates to a printed circuit board and a manufacturing method thereof. A coil element with enough inductance is formed inside the printed circuit board, thereby realizing two layers of minitype and high density printed circuit boards for greatly reducing the section of the element, and a method for manufacturing the printed circuit board in low cost and stably, characterized in that, the coil has a twist wiring pattern(7) and a conduction magnet part (30) arranged on the center of the wiring pattern and electrically connected therewith, and electrical connection between the layers is processed through the conduction magnet part.

Description

technical field [0001] The present invention relates to a printed circuit board and a manufacturing method thereof, and more particularly to a printed circuit board in which a coil having an inductance is formed and a manufacturing method thereof. Background technique [0002] In recent years, in response to demands for miniaturization and higher density of printed circuit boards, it has been required to reduce the mounting area of ​​circuit elements. The number of circuit components mounted on one printed circuit board has been increasing year by year, and the mounting area of ​​these circuit components has become a major obstacle to the miniaturization of printed circuit boards. [0003] The circuit components mounted on the printed circuit board include various components such as semiconductor integrated circuits such as ICs and LSIs, chip capacitors, chip coils, and chip resistors that are simultaneously provided thereon. If a conventional chip coil is taken as an examp...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K1/16H05K3/46H01L23/498H01L21/48
CPCH01L2924/0002
Inventor石原庆延
OwnerNIPPON MEKTRON LTD