Composition surface LED and surface LED module of conductive substrate
A diode module and light-emitting diode technology, which is applied to semiconductor devices, light sources, circuits, etc. of light-emitting elements, can solve problems such as solder hot melting, inability to maintain product flatness and consistency, and exposed solder joint strength.
Inactive Publication Date: 2008-12-03
LITE ON TECH CORP
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Problems solved by technology
However, the joining method of using laser spot welding surface light-emitting diodes to the conductive substrate will have the problems of solder exposure and low joint strength, and it is a one-time joint, so the surface light-emitting diodes and the conductive substrate cannot be separated after bonding, which means a This is an irreversible combination method, so when the surface light-emitting diodes soldered to the conductive substrate are defective products, they cannot be replaced. Furthermore, because the brake lights and direction lights for vehicles are in a high-temperature, high-current, and high-vibration operating environment, when When the operating temperature of the surface light-emitting diode is too high and overheated, the solder will be melted and the bonding strength between the surface light-emitting diode and the conductive substrate will be insufficient. In addition, the high-vibration environment may cause the surface light-emitting diode to detach from the conductive substrate, resulting in The product is damaged; in addition, the bonding method of stamping the surface LED and the conductive substrate will cause the surface LED and the conductive substrate to be deformed, and the overall flatness and consistency of the product cannot be maintained
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[0018] see figure 1 and figure 2 , figure 1 It is a schematic diagram of the appearance of a surface light-emitting diode module 50 of the present invention, figure 2 It is an exploded schematic view of the components of the surface light emitting diode module 50 of the present invention. The surface light emitting diode module 50 includes a conductive substrate 52 including a first electrode area 521 and a second electrode area 522 . The first electrode region 521 can be an anode region and the second electrode region 522 can be a cathode region, or the first electrode region 521 can be a cathode region and the second electrode region 522 can be an anode region, the first electrode region 521 and the second electrode region 522 are insulated from each other, and the first electrode region 521 and the second electrode region 522 of the conductive substrate 52 are used to externally connect and provide power for the surface LED module 50 . The surface light-emitting diode...
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The invention discloses a surface light emitting diode (LED) module, which comprises a conducting substrate comprising a first electrode zone, wherein a first hole is arranged on the first electrode zone; a surface LED installed on the conducting substrate and comprising a first electrode pin for contacting with the first electrode zone, wherein a second hole is arranged at a position on the first electrode pin corresponding to the first hole; and a first fixing element passed through the second hole and the first hole for fixing the conducting substrate on the surface LED.
Description
technical field [0001] The invention provides a surface light-emitting diode module, in particular relates to a surface light-emitting diode module which can be tightly bonded to a surface light-emitting diode and a conductive substrate. Background technique [0002] In recent years, the application fields of high-brightness light-emitting diodes have been continuously developed. Different from ordinary incandescent light bulbs, LEDs are cold light emitting diodes, which have the advantages of low power consumption, long component life, no need to warm up the lamp, and fast response speed. In addition, they are small in size, resistant to vibration, suitable for mass production, and easy to cooperate with applications. It needs to be made into extremely small or arrayed components, so light-emitting diodes have been widely used in indicator lights and display devices of information, communication and consumer electronics products. In addition to being used in various outdoo...
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Login to View More IPC IPC(8): F21V19/00H01L33/00H01L23/48F21Y101/02F21Y115/10H01L33/62
Inventor 林贞秀陈明言
Owner LITE ON TECH CORP