Memory body IC testing and sorting machine

Abstract

The invention relates to a memory IC testing and sorting machine, which comprises a feeding case and at least one receiving box which are arranged at the front end of a machine base and at least one testing device, locating device and jacking device which are arranged at the rear end of the machine base and a material moving device arranged between the feeding and receiving boxes and the testing device. The feeding and receiving boxes are respectively used for containing memory ICs to be tested and tested; each testing device is provided with a testing circuit board provided with a plurality of test sleeve seats; the material moving device can move and carry a plurality of memory ICs in the feeding box to the locating device for locating and move and carry the memory ICs above each test sleeve seat of the testing device after the locating is completed; after the jacking device opens the test sleeve seat by pushing, the material moving device can place the memory ICs in each test sleeve seat; after the jacking device lifts to close the test sleeve seat, the memory ICs can be fixed in the test sleeve seat for performing test operation; therefore, a plurality of memory ICs can be moved and tested simultaneously so as to effectively shorten the standby time, and greatly improving the capacity of testing the memory ICs.

Description

technical field [0001] The invention relates to an IC detection and classification machine, in particular to a memory IC detection and classification machine. Background technique [0002] Nowadays, the ICs of semiconductor components are roughly divided into different types such as logic ICs, memory ICs, analog ICs, and micro-component ICs. Taking logic ICs as an example, they are applied to the central processing unit on the motherboard to be responsible for the communication between the central processing unit and the micro-component IC. The signal conversion or transmission of other peripheral components, as well as the calculation operation, have more complex functions, while the memory IC is simply used to store data and installed on the module circuit board, and the module circuit board is then assembled on the host computer. On the board, its functionality is relatively simple, but no matter what type of IC, after the production is completed, it must go through a tes...

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Problems solved by technology

[0004] On the other hand, memory ICs are purely used to store data, and their functionality is relatively simple. Therefore, multiple memory ICs are generally used for testing at the same time; , it cannot transfer and test multiple memory ICs to be tested at the same time, and only a single memory IC to be tested is carried at a time through the transfer device, which will make the standby time of the entire material transfer too long. If there are several The large-scale memory IC testing machine of the test device, the operation and waiting time of each device will be more cumbersome and time-consuming, and the testing capacity of the memory IC will be greatly reduced. Therefore, the IC testing and sorting machine is not suitable for performing memory IC testing. Detection job

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