318results about How to "Reduce standby time" patented technology

A semiconductor device producing apparatus is disclosed. The apparatus includes a carrier-holding stage for placing a carrier; first, second and third stages each for holding first and second boats one at a time, each boat holding one or more substrates; a boat transfer mechanism for transferring the boats among the first, second and third stages; and a substrate transfer mechanism for transferring the substrate(s) from the carrier to the boat held by the first stage. A controller controls the first stage, the boat transfer mechanism and the substrate transfer mechanism so that the boat transfer mechanism transfers one of the boats from the second stage to the first stage, the substrate transfer mechanism then transfers the substrate(s) from the carrier to the boat held by the first stage, and the first stage then moves the boat into the processing chamber for processing.

A system that can be assembled at a well drilling or other site for storing bulk material such as sand includes a plurality of storage bins configured as trailers, a skid that includes a lower conveyor, a bucket elevator and a top conveyor system. At the site, the bins and the elevator are vertically oriented and stood on the skid, resulting in discharge outlets on the bins becoming positioned over the lower conveyor. The top conveyor is installed on top of the bins. In operation, the elevator lifts the material and discharges it onto the top conveyor system. The top conveyor system discharges the material into the bins for storage. The stored material is controllably discharged from the discharge outlets of the bins onto the lower conveyor from which the material is conveyed to one end of the skid for transport to a new location or directly into a blender.

The invention discloses a user equipment (UE) power saving method and a system thereof. The method comprises the following steps: UE sends a request message of entering into a power saving state to an evolved Node B (eNB) and requests to modify self configuration; the eNB receives the request message and indicates the UE to enter into the power saving state; the UE executes a corresponding operation according to indication of the eNB and enters into the power saving state. Through the method and the system of the invention, problems of waste of electric quantity of a cell of the UE and shortening of standby time caused by that the UE monitors physical downlink control channel (PDCCH) and other unnecessary data transmission excessively when a network application and a service are finished are solved.

A positioning control device includes a GPS hardware control unit that makes GPS determine a current location at different positioning accuracies, and a positioning request management unit that makes the GPS hardware control unit carry out positioning in response to a positioning request from an application according to a positioning accuracy specified in the positioning request, acquires the positioning result, and returns the acquired positioning result to the application of the request origin. In a case where a positioning accuracy of a new positioning request is equal to or less than a positioning accuracy of a latest positioning result, the positioning request management unit reuses the latest positioning result and returns the latest positioning result in response to the new positioning request.

The invention discloses a non-contact three-dimensional optical measuring head and a non-contact three-dimensional optical measuring method for in-situ measurement of a numerical control machine, which are characterized in that: the non-contact three-dimensional optical measuring head consists of an image measuring system and a focus positioning system. The non-contact three-dimensional optical measuring method comprises the following steps of: firstly, making a focus judgment on the image measuring system by using an astigmatism method, determining a measuring plane, positioning the non-contact three-dimensional optical measuring head in a Z-axis direction at the same time and acquiring a Z-axis direction positioning value of a surface characteristic point of a workpiece; secondly, performing two-dimensional image measurement on basic geometric elements, of the workpiece, on the measuring plane by using a surface measuring method in image projection measurement to obtain two-dimensional plane coordinate values of the surface characteristic point of the workpiece; and finally, combining the two-dimensional plane coordinate values with the Z-axis direction positioning value to obtain the three-dimensional coordinate values of the surface characteristic point of the workpiece. The non-contact three-dimensional optical measuring head and the non-contact three-dimensional optical measuring method can effectively perform high-precision in-situ measurement of the geometric size of the workpiece processed by the numerical control machine, shorten the manufacturing period of products effectively and guarantee product quality.

The present invention discloses a method, an apparatus and a system for low-density parity-check (LDPC) coding and decoding. The coding method includes the following steps: constructing each layer of a check matrix of a layered LDPC code used as an error correcting code; when data is initially sent by a data transmitting terminal, performing first-layer-coding of the data to be sent by using the first layer of a check matrix of the LDPC code, sending the first-layer-coded data; when data for (n−1)th retransmission is sent by the data transmitting terminal, performing nth-layer-coding of the data by using the nth layer of a check matrix of the LDPC code, sending the nth-layer-coded data, wherein n is an integer no less than 2. It is possible to reduce the system overhead, decrease the decoding delay, and improve the decoding performance by using the technical solution of the present invention which is also adapted to high-speed data services.

The invention provides a high-density printed circuit board (PCB) test machine comprising a material platform, PCB clamping sampling mechanisms, an automatic material feeding and discharging device, a test clamp and a central controller. Due to the combination of the operation of the automatic material feeding and discharging device and the control of the alignment of the PCB clamping sampling mechanisms and the test clamp, the PCB can be tested automatically, and the PCB test capacity, precision and efficiency of the high-density PCB test machine can be greatly improved. The invention also provides a high-density PCB test method based on the high-density PCB test machine. Due to the unified material loading and the combination of the two PCB clamping sampling mechanisms, the two PCB clamping sampling mechanisms can collect the images of the PCBs thereon at the same time and feed back the collected images of the PCBS to the central controller to test the alignment of the two PCB clamping sampling mechanisms and the test clamp. Due to the timely material unloading and the material reloading after the test of two PCB clamping sampling mechanisms and the test clamp, the standby time of the test clamp is shorted to the maximum extent, the whole test process is standardized, and the test efficiency is ensured.

A nucleic acid automatic examining device implements a hybridization reaction step after implementing a nucleic acid amplification reaction step on a nucleic acid sample containing a target nucleic acid. The device includes a nucleic acid amplification unit, a hybridization reaction unit, a dispenser unit for moving the nucleic acid sample from the nucleic acid amplification unit to the hybridization reaction unit, and a detector for detecting presence or absence of a reaction cassette in the hybridization reaction unit. When the detector detects the absence of the reaction cassette, the device implements steps up to the nucleic acid amplification reaction step and the dispenser unit is stopped so that the device may not implement the subsequent hybridization reaction step.

One of reverse passing parts provided in a substrate passing part comprises a first holding mechanism and a second holding mechanism. The first holding mechanism and the second holding mechanism are arranged in vertically symmetry with respect to a rotary central axis and rotate 180 degrees about the rotary central axis, to replace each other in position. A transport robot on the loading side passes a substrate to a third holding mechanism or a fourth holding mechanism at a first vertical position. The substrate reversed in the reverse passing part is passed to a transport robot on the unloading side from the third holding mechanism or the fourth holding mechanism at a second vertical position. Before a reverse process on the preceding substrate is finished, the transport robot on the loading side can start the transfer of the following substrate.

According to this invention, in printing from a mobile terminal to a printer, the distance between them is measured in an LE mode, and when the distance reaches a predetermined distance, print data is transmitted to the printer in a normal mode and held in the printer. When the distance becomes shorter, a print execution instruction is issued to the printer in the normal mode, thereby causing the printer to execute printing.

The invention relates to a multi-station welding fixture with external power supply used in the gas shielded weld, the laser weld, and the vacuum election beam welding. Without extra electromechanical control system, the invention adopts common welding revolving table as power supply and is not provided with momentum and control system, so the invention utilizes the revolving table momentum to drive a plurality of components to spin and transform work stations, and realizes automatic multi-work-station welding process. The design of the stopping step and the locking handle realizes the transform between the work station transformation and the component spin and matched revolving table, which can satisfy the welding requirements of gyrating welding joint at any angle form 0 to 90 degrees. The invention has the advantages that: when welding, in particular to precision welding such as the laser welding and the election beam welding, the standby time due to assembly is decreased, and work efficiency is improved.

The invention discloses a welding control system and a control method thereof, the first image acquisition module, the second image acquisition module, the first welding workbench clamping sensor, the second welding workbench clamping sensor, the welding workbench distance The sensor and the welding table moving motor control button are respectively connected to the input port of the PLC; the welding detection camera is connected to the weld image processing module, and then the weld image processing module is connected to the input port of the PLC; one end of the welding robot control system is connected to the PLC , the other end is connected to the main body of the robot; the first contactor coil, the second contactor coil, the third contactor coil and the fourth contactor coil are connected to the output end of the PLC. The control system can automatically identify the workpiece type, thereby automatically selecting the processing program, and can automatically detect the welding quality. The control method of the control system can reduce processing time and reduce the standby time of the welding torch.

The invention provides a probe apparatus. The apparatus uses the probe card to invest the electrical characteristics of IC chip on wafer to improve the transferring efficiency and realize high production efficiency. The probe apparatus is provided with a load port for mounting therein a carrier having therein a plurality of substrates; a plurality of probe apparatus main bodies, each having a probe card having probes on its bottom surface; a substrate transfer mechanism for transferring the substrates between the load port and the probe apparatus main bodies, the substrate transfer mechanism being rotatable about a vertical axis and movable up and down. The substrate transfer mechanism has at least three substrates capable of moving back and forth independently. Further, at least two wafers are received from the carrier by the substrate transfer mechanism, and then are sequentially loaded into the probe apparatus main bodies.

The invention relates to a dynamic soldering technique, comprising the clamping rotary table, fixture, welding part and the soldering seam positioning part, the said fixture set on the clamping rotary table, the soldering part connected in partial connection with the welding seam positioning part, the said clamping rotary table having two sets of fixtures in axial rotation of 180 degree. It effectively makes up the defects of the manual and robot welding, with extensive application.

The invention discloses an automatic yarn feeding device for a full-automatic hank mercerizing machine, which improves the automation degree and production efficiency of the full-automatic hank mercerizing machine and improves the working conditions. The automatic yarn feeding device comprises a sliding table, an upright post, a swing arm and a yarn support tube bracket; a sliding table seat and a mechanism borne by the sliding table seat can enter or exit along the axis direction of a mercerizing roll to feed or discharge yarns for the mercerizing roll; the swing arm can rotate front and back 180 degrees on a horizontal plane to replace mercerized and non-mercerized yarns; and yarn bracket of the swing arm is provided with yarn support tubes, and the upper and lower opposite yarn support tubes form a group. During feeding yarns, the two yarn support tubes are inserted into the outer edge of the mercerizing roll in an opposite state and rotate 180 degrees in a reverse state, the unprocessed yarns fall on the mercerizing roll, and the yarn support tubes are retracted and separated from the mercerizing roll. During discharging the yarns, the two yarn support tubes are reversely inserted between the mercerizing rolls and rotate 180 degrees in an opposite state, the mercerized yarns fall on the yarn support tubes, and the yarn support tubes are retracted and separated from the mercerizing rolls.

The invention discloses a cylinder body turnover type cleaning machine which comprises a base, wherein a revolution cleaning frame is mounted on the base in a rotating manner, the revolution cleaning frame is in power connection with a revolution driving device, a cleaning working area is arranged on one side of the revolution cleaning frame, two working positions which are driven by rotation of the revolution cleaning frame to alternately enter into the cleaning working area are arranged on the revolution cleaning frame, a cylinder body turnover bracket is mounted on the revolution cleaning frame in a rotating manner, the cylinder body turnover bracket is in power connection with a turnover driving device, and a cylinder body fixing and clamping device is arranged between the cylinder body turnover bracket and a cylinder body; and a cylinder body cleaning device is mounted in the cleaning working area. Driven by the rotation of the resolution cleaning frame, the two working positions can alternately enter into the cleaning working area, the standby time is reduced and the production efficiency is improved; and the cylinder body is clamped on the cylinder body turnover bracket on the two working positions, the cylinder body turnover bracket can drive the cylinder body to overturn, all the surfaces of the cylinder body can be conveniently cleaned, the heavy and trivial manual turnover operation can be avoided, and the production efficiency is also greatly improved.

In an ink-jet printing apparatus which includes a plurality of printing heads, each having an array of ink discharging elements, preliminary discharge of driving the elements of at least one printing head is performed a predetermined number of times. The printing head for which the preliminary discharge is to be performed is switched in a predetermined cycle. In performing the preliminary discharge, switching of the printing head is so controlled as to perform preliminary discharge a desired number of times for all the elements of the printing heads by repeating the cycle.

The invention discloses a method for determining the state of testing hardware by using statistical test data in the process of testing a wafer of an integrated circuit. The test data generated in the process of testing the wafer reflects the physical parameter of each chip, the function of an internal module, a manufacturing process of each chip, and the state of the testing hardware in the testing process. By a site yield statistical method for a multi-site parallel test, whether the state of the testing hardware in the testing process is defective or not is checked. By the method, the yield of each site is obtained through the statistical induction of massive test data, and specific bin value distribution is obtained, so that the failure cause of the testing hardware can be quickly found, solution measures are taken, and test quality is ensured.