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High-density printed circuit board (PCB) test machine and method

A testing method and testing machine technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve problems such as increasing PCB packaging density, and achieve the effect of improving testing capabilities

Active Publication Date: 2010-06-30
SHENZHEN MASONE ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous improvement of chip packaging technology nowadays, the packaging density of its IC is getting denser, and the packaging density of its PCB board is also getting denser, which puts forward higher requirements for the wiring process of PCB. After the technology is improved, due to the small area of ​​the HDI board and IC carrier board, in order to adapt to the new wiring technology, the traditional PCB positioning holes are canceled, which makes the traditional PCB testing machine and testing technology unable to meet the increasingly high PCB packaging requirements. Density, in order to adapt to the new PCB packaging density, the industry urgently needs a corresponding new high-density PCB testing machine and testing method for the required

Method used

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  • High-density printed circuit board (PCB) test machine and method
  • High-density printed circuit board (PCB) test machine and method
  • High-density printed circuit board (PCB) test machine and method

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Embodiment Construction

[0041] The following describes in detail the implementation of XX of the present invention in conjunction with the accompanying drawings.

[0042] Such as figure 1 , 2 Shown, the present invention relates to a kind of high density PCB testing machine, it comprises:

[0043]Material table 1 includes four parts: the board to be tested placement area 101, the paper release area 102, the passed test board area 103, and the failed test board area 104. The setting of the material table 1 is used to load the PCB to be tested and provide good classification loading Good or bad PCB boards after testing.

[0044] There are PCB board clip sampling mechanisms 2 arranged side by side on the side of the material table 1, and usually in order to improve the use efficiency of the test fixture of the testing machine, at least two sets of clip sampling mechanisms 2 should be provided in the testing machine. In this embodiment, there are Two sets of independent snap-position alignment mechani...

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Abstract

The invention provides a high-density printed circuit board (PCB) test machine comprising a material platform, PCB clamping sampling mechanisms, an automatic material feeding and discharging device, a test clamp and a central controller. Due to the combination of the operation of the automatic material feeding and discharging device and the control of the alignment of the PCB clamping sampling mechanisms and the test clamp, the PCB can be tested automatically, and the PCB test capacity, precision and efficiency of the high-density PCB test machine can be greatly improved. The invention also provides a high-density PCB test method based on the high-density PCB test machine. Due to the unified material loading and the combination of the two PCB clamping sampling mechanisms, the two PCB clamping sampling mechanisms can collect the images of the PCBs thereon at the same time and feed back the collected images of the PCBS to the central controller to test the alignment of the two PCB clamping sampling mechanisms and the test clamp. Due to the timely material unloading and the material reloading after the test of two PCB clamping sampling mechanisms and the test clamp, the standby time of the test clamp is shorted to the maximum extent, the whole test process is standardized, and the test efficiency is ensured.

Description

【Technical field】 [0001] The invention relates to the field of electrical performance testing of printed circuit boards, in particular to a high-density PCB testing machine for electrical performance testing of high-density (HDI) PCBs or IC carrier boards and a testing method thereof. 【Background technique】 [0002] With the continuous improvement of chip packaging technology nowadays, the packaging density of its IC is getting denser, and the packaging density of its PCB board is also getting denser, which puts forward higher requirements for the wiring process of PCB. After the technology is improved, due to the small area of ​​the HDI board and IC carrier board, in order to adapt to the new wiring technology, the traditional PCB positioning holes are canceled, which makes the traditional PCB testing machine and testing technology unable to meet the increasingly high PCB packaging requirements. Density, in order to adapt to the new PCB packaging density, the industry urgen...

Claims

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Application Information

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IPC IPC(8): G01R31/00
Inventor 武勇候育潘海杨朝辉
Owner SHENZHEN MASONE ELECTRONICS
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