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Method for increasing energy band gap of aluminum oxide layer and method of manufacturing storing device

A technology of aluminum oxide layer and energy bandgap, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of reduced thickness of blocking oxide film, insufficient charge retention capacity of storage devices, etc., and achieve stable charge retention effect of ability

Inactive Publication Date: 2009-02-25
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the thickness of the blocking oxide film decreases as the integration level of the next-generation memory increases, the charge retention capability of the related art aluminum oxide film may not be sufficient for the development of the next-generation memory device.

Method used

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  • Method for increasing energy band gap of aluminum oxide layer and method of manufacturing storing device
  • Method for increasing energy band gap of aluminum oxide layer and method of manufacturing storing device
  • Method for increasing energy band gap of aluminum oxide layer and method of manufacturing storing device

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Embodiment Construction

[0040] Various example embodiments will now be described more fully with reference to the accompanying drawings, in which some example embodiments are shown. In the drawings, the thicknesses of layers and regions are exaggerated for clarity.

[0041] Detailed illustrative example embodiments are disclosed herein. However, specific structural and functional details disclosed herein are merely representative for purposes of describing example embodiments. This invention may, however, be embodied in many alternative forms and should not be construed as limited to only the example embodiments set forth herein.

[0042] Therefore, although the example embodiments are capable of various modifications and alternative forms, the examples of the example embodiments are shown by way of example in the drawings and will be described here in detail. It should be understood, however, that there is no intent to limit example embodiments to the particular forms disclosed, but on the contrar...

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Abstract

This invention provides a method for increasing band gap of aluminum oxide layer and a method for manufacturing charge trapping storage device, namely, this invention provides a charge trapping storage device comprising crystal aluminum oxide with increased band gap and crystal aluminum oxide layer, and manufacture method thereof. A method for increasing band gap of aluminum oxide layer comprises: forming non-crystal aluminum oxide layer on lower film; introducing hydrogen (H) or hydroxyl (OH) in the non-crystal aluminum oxide layer, in order to realize crystallization of non-crystal aluminum oxide containing H or OH.

Description

technical field [0001] The present invention relates to a crystalline alumina layer, a charge trapping memory device comprising the crystalline alumina layer, and a method of manufacturing the same, and more particularly, to a crystalline alumina layer having an increased energy bandgap, a crystalline alumina layer comprising the crystalline alumina layer Charge trapping memory device and method of manufacturing the same. Background technique [0002] A related art charge trap flash memory device (hereinafter, referred to as a memory device) may include a metal electrode, a blocking oxide film, a charge trap layer, a tunnel oxide film, and a silicon substrate. The charge retention capability of these exemplary prior art memory devices may be determined by the deep trapping energy of the charge trap layer, the thickness of the tunnel oxide film, and the electrical characteristics of the blocking oxide film. For example, the electrical characteristics of the blocking oxide fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/31H01L21/28H01L21/336H10B69/00
CPCH01L29/4234H01L29/66833H01L29/792H01L21/0223H01L21/0226
Inventor 崔相武成政宪薛光洙申雄澈朴祥珍
Owner SAMSUNG ELECTRONICS CO LTD