Preparation of polyimide film

A polyimide film and polyimide technology are applied in the field of preparation of high molecular polymer films, which can solve the problems of poor film-forming properties of polybenzoxazole imide containing bisoxazole rings, and achieve strong acid resistance. sexual effect

Inactive Publication Date: 2009-04-15
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The object of the present invention is to provide a synthesis method of polybenzoxazole imide film containing monooxazole ring, which solves the problem of polybenzoxa

Method used

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  • Preparation of polyimide film

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specific Embodiment approach 1

[0011] Specific embodiment one: the preparation method of the polyimide film of the present embodiment is realized according to the following steps: one, 5-amino-2-(p-aminobenzene) benzoxazole is dissolved in the N, N ' - in dimethylacetamide, then add pyromellitic dianhydride, in N 2 Under the protection of the environment, react at a temperature of 0-5°C for 3-6 hours to obtain polyamic acid; 2. Pour the polyamic acid prepared in step 1 on a glass sheet, cast it into a film, and dry it at room temperature for 3-6 hours. 4 hours, and then dry in a vacuum dryer for 24 to 30 hours; 3. Heat up the glass sheet treated in step 2 at a heating rate of 10°C / min, and keep the temperature at 100°C, 150°C, 200°C and 300°C in turn 1 hour, keep the temperature at 350°C for 0.5 hours; 4. Cool the glass sheet treated in step 3 to room temperature, and then boil it to remove the film to obtain a polyimide film; wherein the structural formula of polyimide is n represents the degree of polym...

specific Embodiment approach 2

[0013] Embodiment 2: This embodiment is different from Embodiment 1 in that the reaction temperature in step 1 is 1-4°C. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0014] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the reaction temperature in step 1 is 3°C. Others are the same as in the first embodiment.

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Abstract

The invention discloses a preparation method of a polyimide film, which relates to a preparation method of a high molecular polymer film. The invention aims at providing a synthesis method of a polybenzoxazole imide film containing a single oxazole ring, which solves the problem of poor film forming ability of polybenzoxazole imide containing a dual oxazole ring under a condition without sacrificing the thermal property of a polymer. The method includes the following steps: firstly, 5-amido-2-(phenetidine)benzoxazole and N, N'-dimethylacetamide are mixed and stirred and added with aromatic dianhydride and then a polyamide acid is obtained after reaction is finished; secondly, the polyamide acid prepared in the first step is casted into film and dried; thirdly, heat treatment is carried out; and fourthly, the polyimide film is obtained through water boiling and stripping. The polyimide film prepared by the method is good in thermal property, strong in acid resistance and high in mechanical property. The preparation method is simple and has good film forming performance.

Description

technical field [0001] The invention relates to a preparation method of a polymer film. Background technique [0002] With the development of aerospace technology, various newly developed aircrafts put forward higher requirements on the high temperature resistance of materials. Among many materials, polyimide has become a hot topic for scientists to study because of its excellent high temperature resistance, radiation resistance, low temperature resistance, mechanical and mechanical properties and good chemical and physical stability. In the research of high temperature resistant polyimide (PI), the improvement of heat resistance is mainly from the design of the molecular structure of polyimide, and the design of molecular structure is mainly from the synthesis of polyimide The structure of amine and dianhydride monomers was studied. In recent years, in order to improve the heat resistance of polyimide, chemists have introduced heterocycles containing sulfur, nitrogen, oxy...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08G73/10
Inventor 孟祥丽黄玉东宋美霞
Owner HARBIN INST OF TECH
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