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Sensor element, device and method for inspecting a printed conductor structure, production method for sensor element

A technology for printed circuits and processing methods, which can be used in measurement devices, electronic circuit testing, non-contact circuit testing, etc., and can solve problems such as incompatibility

Inactive Publication Date: 2012-01-11
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are defects in this inspection method. The surface to be inspected must be rotated relative to the metal tip, so the inspection method is not suitable for printed circuit structures formed on planar carriers.

Method used

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  • Sensor element, device and method for inspecting a printed conductor structure, production method for sensor element
  • Sensor element, device and method for inspecting a printed conductor structure, production method for sensor element
  • Sensor element, device and method for inspecting a printed conductor structure, production method for sensor element

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Embodiment Construction

[0075] It should be noted here that the reference signs of identical or mutually corresponding parts in the figures differ only in their first digits.

[0076] figure 1 An inspection device 100 is shown for the contactless inspection of printed circuit structures 131 formed on a planar carrier 130 . According to the exemplary embodiment shown here, the planar carrier is a planar display substrate 130, on which a printed circuit matrix 131 is formed according to the previous processing steps for processing the LCD planar display substrate 130, via which a plurality of thin film transistor.

[0077] The examination device 100 has a frame or base 101 on which a receiving unit 102 is arranged. According to the exemplary embodiment shown here, the receiving unit 102 is a fastening table 102 for receiving a flat screen substrate 130 .

[0078] Two parallel-aligned guides 103 are arranged on the base 101 . Two guides 103 support transverse support arms 104 . The transverse suppo...

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PUM

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Abstract

The invention relates to a sensor element for inspecting a printed conductor structure (131) that is mounted on a flat support (130). The sensor element (250) comprises a substrate (251), which is mechanically structured in such a way that it has a raised upper region (260) and lowered lower region (280) said planar upper (260) region and lowered lower region (280) being interconnected by a preferably step-type transition region (270). The sensor element (250) also comprises a plurality of sensor electrodes (261), arranged on the planar upper region (260) and a plurality of connecting conductors (471) for electrically connecting the plurality of sensor electrodes (261). A connecting conductor (471) is connected to each sensor electrode (261), said conductor extending from the respective sensor electrode (261) to the lowered lower region (280). The invention also relates to a device and a method for inspecting a printed conductor structure (131), in addition to a production method for the aforementioned sensor element.

Description

technical field [0001] The invention relates to a sensor, a device and a method for inspecting printed circuit structures formed on a planar carrier, in particular for the contactless inspection of a printed circuit matrix formed on a planar display substrate. The present invention also relates to the processing method of the above-mentioned sensor. Background technique [0002] In the field of processing liquid crystal displays (LCDs), it is necessary for efficient and economical processing to inspect the electrical TFT electrodes (Thin Film Transistor Electrodes) on glass substrates for identifying possible defects during the processing of LCDs in as timely a manner as possible . [0003] A method for inspecting wafers is known from US Pat. No. 5,974,869, in which the wafer surface is scanned contactlessly by a metal tip. Simultaneously, the potential difference between the metal tip and the wafer surface is measured, where the work output of electrodes composed of diffe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/312G09G3/00
CPCG01R31/312G01R31/2812G09G3/00
Inventor H·克劳斯曼K·克拉格勒
Owner SIEMENS AG