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Semi-conductor substrate cleaning method

A semiconductor and substrate technology, applied in the field of semiconductor substrate cleaning, can solve problems such as difficulty in obtaining a clean semiconductor substrate surface, and achieve the effects of promoting comprehensive distribution, enhancing cleaning effect, and enhancing cleaning ability

Active Publication Date: 2009-06-17
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in actual production, it is found that when the above-mentioned method is used to clean the semiconductor substrate, it is difficult to obtain a clean surface of the semiconductor substrate, especially in the edge region of the semiconductor substrate.

Method used

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Embodiment Construction

[0026] Although the invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it should be understood that those skilled in the art can modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be understood as a broad instruction for those skilled in the art, rather than as a limitation of the present invention.

[0027] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to achieve the developer's specific goals, such as changing from one embodiment to another in accordance with sy...

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Abstract

A method for cleaning a semiconductor substrate comprises steps of rotating the semiconductor substrate, frequently reducing the rotating speed of the semiconductor substrate during the process of utilizing acid oxidizing solution to clean the semiconductor substrate, and utilizing alkali oxidizing solution to wash the semiconductor substrate cleaned by the acid oxidizing solution, thereby obtaining a clean semiconductor base surface, and strengthening cleaning efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor substrate cleaning method. Background technique [0002] As a basic process in the semiconductor manufacturing process, cleaning is widely used in various stages of the semiconductor manufacturing process. For example, a cleaning process is required in the step of removing the resist layer after the etching, in the step of removing the surface residue after the etching, and in the step of removing the surface residue after the ion implantation. [0003] Typically, the cleaning operation may be performed using a wet trench or single wafer clean process. Due to the excellent cleaning effect and the short duration of the cleaning operation, currently, the industry generally adopts a single-wafer cleaning process to perform the cleaning operation. [0004] The industry has been devoting itself to the attempt to optimize the cleaning effect, such ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/306B08B3/04
Inventor 刘佑铭朴松源
Owner SEMICON MFG INT (SHANGHAI) CORP