Heat radiator
A technology of radiator and heat sink, which is applied in the direction of electric solid device, semiconductor device, cooling/ventilation/heating transformation, etc., can solve the problems of separation of heat sink and failure of radiator 30, and achieve the effect of structural stability
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[0013] Such as figure 2 As shown, the heat sink 10 of the present invention is formed by a first heat dissipation fin 11 and a plurality of second heat dissipation fins 13 on one side of the first heat dissipation fin 11 interlocked with each other. The heat sink 10 is used for contacting with electronic components (not shown) to absorb the heat dissipated by them.
[0014] Please also see image 3 and Figure 4 , the first heat sink 11 is located at one end of the heat sink 10 , and includes a rectangular body 110 and two folded edges 111 perpendicularly extending from two short sides of the body 110 in the same direction. Two opposite ends of each long side of the main body 110 are provided with two square notches 113 . Each square notch 113 has an outer edge (not marked) close to the folded edge 111 close to it, an inner edge (not marked) opposite to the outer edge, and a connecting edge vertically connecting the outer edge and the inner edge (not shown). A locking po...
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