Surface bonding type film fuse structure and manufacturing method thereof

A manufacturing method and fuse technology, which is applied in the manufacture of fuses, emergency protection devices, electrical components, etc., can solve problems such as burnout, damage to electronic circuits of electrical devices, and inability to achieve circuit protection effects

Active Publication Date: 2009-07-01
颜琼章
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When in use, the entire surface-mounted fuse uses the melting link 13 to form the circuit conduction of the two electrode parts 12. Therefore, when the excess current passes through the melting link, it will generate high temperature or a specific temperature and cause it to fuse, so as to achieve The circuit protection effect of blocking excess current; however, in reality, when the melting link 13 is energized and generates a heat source, this part of the heat source will be due to the contact betwee

Method used

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  • Surface bonding type film fuse structure and manufacturing method thereof
  • Surface bonding type film fuse structure and manufacturing method thereof
  • Surface bonding type film fuse structure and manufacturing method thereof

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Embodiment Construction

[0030] The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments.

[0031] The surface mount type thin film fuse structure and its manufacturing method of the present invention, wherein, the surface mount type thin film fuse structure 2 is as figure 2 and image 3 As shown, at least one side of an insulating substrate 21 is provided with a fuse circuit structure 22, and this fuse circuit structure 22 is connected to a melting link part 222 between two corresponding electrode parts 221, and the melting link part 222 A tin layer 23 is provided in the middle of the surface of the fuse circuit structure, and a protective layer 24 is provided at the melting link part 222 of the fuse circuit structure to prevent oxidation of the melting link part 222 and the tin layer 23 and to prevent molten metal from splashing out. At least one space 25 is provided between the chain part 222 and the insulating ba...

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Abstract

The invention relates to an adhesion film fuse structure. A face of at least an insulating base unit is provided with a fuse line framework which is connected with a melting part between two corresponding electrode portions. The melting part is fused by high temperatures or a specific temperature when excess current flows through the melting part, thereby realizing circuit protection effect to block excess current. At least a space is arranged between the melting part and the insulating base unit, thus the heat source generated by powering on the melting part will not have dissipation phenomenon through the insulating base unit in order to reach a specific current or the specific temperature to burn out, thereby ensuring circuit protection effect.

Description

technical field [0001] The present invention provides a surface-mounted thin film fuse structure and its manufacturing method, especially a surface that can reliably maintain the circuit protection effect of the surface-mounted thin-film fuse reaching a specific current or a specific temperature and causing a fuse to block excess current. A junction type film fuse structure and a manufacturing method thereof. Background technique [0002] Press, the general electrical device will set the maximum use current. When the current used exceeds, the device may be damaged or burned. The main function of the fuse is to prevent the excess current from passing through the electronic circuit. When the excess current flows When the fuse is used, it will generate high temperature and cause fusing to protect the circuit from damage. In existing electrical devices such as information, communication, and consumer electronics products, printed circuit boards (Printed Circuit Board, PCB) are m...

Claims

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Application Information

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IPC IPC(8): H01H85/04H01H69/02
Inventor 颜琼章
Owner 颜琼章
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