Surface bonding type film fuse structure and manufacturing method thereof

Abstract

The invention relates to an adhesion film fuse structure. A face of at least an insulating base unit is provided with a fuse line framework which is connected with a melting part between two corresponding electrode portions. The melting part is fused by high temperatures or a specific temperature when excess current flows through the melting part, thereby realizing circuit protection effect to block excess current. At least a space is arranged between the melting part and the insulating base unit, thus the heat source generated by powering on the melting part will not have dissipation phenomenon through the insulating base unit in order to reach a specific current or the specific temperature to burn out, thereby ensuring circuit protection effect.

Description

technical field [0001] The present invention provides a surface-mounted thin film fuse structure and its manufacturing method, especially a surface that can reliably maintain the circuit protection effect of the surface-mounted thin-film fuse reaching a specific current or a specific temperature and causing a fuse to block excess current. A junction type film fuse structure and a manufacturing method thereof. Background technique [0002] Press, the general electrical device will set the maximum use current. When the current used exceeds, the device may be damaged or burned. The main function of the fuse is to prevent the excess current from passing through the electronic circuit. When the excess current flows When the fuse is used, it will generate high temperature and cause fusing to protect the circuit from damage. In existing electrical devices such as information, communication, and consumer electronics products, printed circuit boards (Printed Circuit Board, PCB) are m...

AI Technical Summary

Problems solved by technology

[0005] When in use, the entire surface-mounted fuse uses the melting link 13 to form the circuit conduction of the two electrode parts 12. Therefore, when the excess current passes through the melting link, it will generate high temperature or a specific temperature and cause it to fuse, so as to achieve The circuit protection effect of blocking excess current; however, in reality, when the melting link 13 is energized and generates a heat source, this part of the heat source will be due to the contact between the melting link 13 and the insulating substrate 11 , and dissipate this part of the heat source through the heat conduction of the insulating base material 11, so that when the set excess current passes through the melting link part 13, the melting link part 13 cannot reach a specific current or a specific high temperature and will be fused, and then cannot achieve blocking excess The circuit protection effect of electric current, so that the electronic circuit of the electrical device is damaged or burned

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