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Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display

A technology of light-emitting diodes and installation methods, which can be used in printed circuit manufacturing, semiconductor/solid-state device manufacturing, electrical solid-state devices, etc., and can solve problems such as difficulties

Active Publication Date: 2009-07-22
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Causes considerable difficulties from the point of view of cost and production volume of installed units

Method used

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  • Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display
  • Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display
  • Mounting method, mounting structure, method for manufacturing electronic equipment, electronic equipment, method for manufacturing light emitting diode display, and light emitting diode display

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Experimental program
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Embodiment Construction

[0069] Embodiments of the present invention will be described below with reference to the accompanying drawings. In all the drawings of the embodiments, the same or corresponding parts are assigned the same reference numerals.

[0070] First, a mounting method for components according to a first embodiment of the present invention will be described.

[0071] Figure 4 ~ Figure 7 A mounting method for components according to the first embodiment is shown.

[0072] In the first embodiment, as Figure 4 As shown, an element holding layer 12 made of a material whose viscosity can be controlled is first formed on a substrate 11 . The object holding layer 12 may be formed according to any method. Specifically, for example, the element holding layer can be formed by, for example, coating (spin coating, etc.) or printing (contact printing method, imprint method, screen printing, gravure printing, offset printing, etc.). For example, the element holding layer 12 is made of photose...

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PUM

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Abstract

Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably with high positional precision by: forming an element holding layer 12, which is made of a material whose viscosity can be controlled, on a substrate 11; controlling the viscosity of a first part 12a of the element holding layer 12, which includes a mounting region for an element, into a viscosity making the element naturally movable, and controlling the viscosity of a second part 12b of the element holding layer 12 outside the first part 12a into a viscosity making the element naturally immovable; and after mounting one element 13 in the first part 12a, controlling the viscosity of the first part 12a into the viscosity making the element 13 naturally immovable.

Description

technical field [0001] The present invention relates to a mounting method, a mounting structure, a method of manufacturing an electronic device, an electronic device, a method of manufacturing a light-emitting diode display, and a light-emitting diode display. Background technique [0002] From the viewpoint of picture uniformity, it is generally required that the positional accuracy of each pixel in the display is about 1 / 100 of the pixel pitch. Therefore, in a display manufactured by mounting a self-luminous element such as a light emitting diode on a substrate, an accuracy of mounting position of about 1 / 100 of a pixel pitch is required. For example, in a full high-definition (HD) full-color display with a 40-inch diagonal, since the number of pixels in the horizontal direction of the screen is 1920 and the number of pixels in the vertical direction of the screen is 1080, the pixel pitch reaches 0.461mm and the installation position The required precision reaches ±0.005m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52H01L33/00H01L33/10H01L33/32H01L33/62
CPCH01L2924/01015H01L2924/01023H01L2924/01055H01L2924/01047H01L2924/01079H01L2224/83385H01L2224/27013H01L24/32H01L2924/14H01L2924/15156G09F9/33H01L2924/01005H01L2924/01033H01L33/52H01L2924/01006H01L2924/01078H01L2924/01027H01L2224/83143H01L2924/10349H05K3/305H01L2224/83051H01L2224/26175H01L2924/12041H01L2924/1461H01L2924/15788H01L2924/12042H01L2924/12043H01L2924/15157H01L2924/00
Inventor 友田胜宽土居正人高岸敏哉金光俊明
Owner SONY CORP