In one embodiment, a surface-
mount device comprises a casing having opposed, first and second main surfaces, side surfaces, and end surfaces. A 
lead frame partially encased by the casing comprises (1) an 
electrically conductive LED 
chip carrier part having a surface carrying a 
linear array of three LEDs adapted to be energized to produce in combination a substantially full range of colors, each LED having a first electrical terminal and a second electrical terminal, the first terminal of each of the three LEDs being electrically and thermally coupled to the 
chip carrying surface of the 
chip carrier part; and (2) three 
electrically conductive connection parts separate from the 
chip carrier part, each of the three connection parts having a connection pad, the second terminal of each of the three LEDs being electrically coupled to the connection pad of a corresponding one of the three connection parts with a single wire bond. The 
linear array of LEDs extends in a first direction, and each of the 
chip carrier part and three connection parts has a lead. The leads are disposed in parallel relationship with each other and extend through the end surfaces of the casing in a second direction, the second direction being orthogonal to the first direction. An array of the surface-
mount devices may be used in an 
LED display such as an indoor LED screen.