The invention relates to the technical field of chips, and provides a
wafer reliability control method which comprises the following steps: making a
test plan, and determining items, parameters and test conditions required to be tested for
wafer reliability control; obtaining a target
chip with the same manufacturing process as the
wafer and a hierarchical structure of the target
chip; determining a
test target structure of each item and a level where the
test target structure is located; removing the target
chip layer by layer to obtain a target layer of the target chip, and positioning a target structure, needing to be tested, of the target layer and a target position of the target structure on the target layer; according to the determined target position, setting a test condition, and collecting characteristic parameters of the target structure by using a
nanoprobe imaging analysis system; and obtaining a reliability control
performance index of the target chip according to the characteristic parameters of the target structure, and establishing a reliability control scheme of the new wafer manufacturing process according to the reliability
performance index of the target chip. According to the method provided by the invention, a wafer reliability control scheme of a new manufacturing process can be quickly established.