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Phase-change type micro-passage flowing cooler

A technology of micro-channel and cooler, which is applied in the direction of heat exchanger shell, indirect heat exchanger, lighting and heating equipment, etc., can solve problems such as unevenness and affecting the heat dissipation efficiency of the cooler, and achieve the effect of strengthening heat transfer and reducing The effect of quantity and degree of overheating, large application prospects

Inactive Publication Date: 2011-07-20
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inhomogeneous thermal resistance in the connection between the heat source and the microchannel directly affects the overall heat dissipation performance of the cooler

Method used

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  • Phase-change type micro-passage flowing cooler
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  • Phase-change type micro-passage flowing cooler

Examples

Experimental program
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Embodiment Construction

[0018] A preferred embodiment of the present invention is described in detail as follows in conjunction with accompanying drawing:

[0019] see figure 1 , figure 2 , image 3 , Figure 4 and Figure 5 , the phase change micro-channel cooler comprises a shell 1 and a cover plate 3 matched with the shell, a storage chamber 10 is formed between the shell 1 and the cover plate 3, and a liquid injection is arranged on the cover plate 3 hole 4, the phase change liquid injected is hidden in the storage chamber 10; the top of the storage chamber 10 has a fixedly installed microchannel layer 2 that is close to the lower surface of the cover plate 3, and the microchannel layer 2 The upper surface of the channel layer 2 is uniformly covered with etched rectangular microchannels 5 , and the cover plate 3 has cooling liquid input and output perforations 9 communicating with the input and output ports of the microchannels 5 .

[0020] The two ends of the above-mentioned microchannel l...

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Abstract

The invention relates to a phase-change type micro-passage cooler which comprises an outer shell and a lid matched with the outer shell, a storage chamber is formed between the outer shell and the lid, the lid is provided with a liquid injecting hole, and the storage chamber contains phase-change liquid injected from the liquid injecting hole. The top of the storage chamber is provided with a micro-passage layer which is fixedly arranged and is tightly close to the lower surface of the lid, etched-rectangular micro-passages are uniformly distributed on the lower surface of the micro-passage layer, and the lid is provided with cooling liquid input and output through holes communicated with input and output holes of the micro-passages. The invention has the advantages of high heat transmitting efficiency, low contact heat resistance, low noise, and the like, and is compatible with the production technology of the integrated circuit.

Description

technical field [0001] The invention relates to a microchannel liquid flow type cooler using phase change liquid as a heat equalizing part. Background technique [0002] D.B.TUCKERMAN and R.F.PEASE first proposed the idea of ​​using micromachining technology to etch micron-scale channels, and flowing liquid into these sealed channels to take away heat, and made experimental explorations for their ideas. According to their experimental results, TUCKERMAN claims to be able to 2 The area reaches 790w / cm 2 The heat dissipation rate is 0.09W / ℃. SebastineUjereh et al. studied the application of carbon nanotubes (CNT) in coolers to enhance the ability of nucleate boiling, and pointed out that covering the surface of the heat sink with a layer of CNT can improve the heat transfer performance and street heat flux (CHF) of the original equipment. Silicon or copper-based heat sinks can be combined with this layer of CNT, but the cooler needs to be immersed in a large amount of coola...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28F9/02F28F13/06F28F21/00F28D15/02
Inventor 王小静张敏亮刘红军张雯李宗硕陈玲
Owner SHANGHAI UNIV