Bearing structure and testing device
A technology of carrying structure and testing device, which is applied in the direction of measuring device, measuring device casing, single semiconductor device testing, etc., can solve the problems of inability to accurately obtain the characteristics of wafers or grains, differences in electrical characteristics, etc.
Inactive Publication Date: 2011-05-25
RAYDIUM SEMICON
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Problems solved by technology
[0006] In the method used in the above-mentioned prior art, wherein the chips or dies are arranged on the printed circuit board, the test environment will be different from the original chips or dies, so the electrical characteristics tested will also be different accordingly. and cannot accurately obtain the characteristics of the wafer or die
Method used
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Embodiment Construction
[0037] Please refer to figure 1 , figure 1 A schematic diagram of a load-bearing structure 1 according to a specific embodiment of the present invention is shown. The carrying structure 1 of this specific embodiment can be used to test the wafer part 2 in combination with a test device (not shown in the figure), wherein, the wafer part 2 is cut out from the wafer (not shown in the figure), and in practice Among them, the wafer part 2 can be a wafer, a die or a defective wafer. Such as figure 1 As shown, the carrying structure 1 includes a body 10 , a first receiving groove 12 , a second receiving groove 14 and a fixing member 16 .
[0038] In this specific embodiment, the body 10 has a first surface 100 , the first receiving groove 12 and the second receiving groove 14 are both disposed on the first surface 100 , and the second receiving groove 14 is connected to the first receiving groove 12 . The fixing member 16 is disposed in the second receiving groove 14 , and the fi...
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The invention discloses a bearing structure used for bearing a wafer part cut from a wafer and combining a testing device to test the wafer part. The bearing structure comprises a body, a first accommodating tank, a second accommodating tank and a fixing component, wherein the size of the body is equal to that of the wafer; the first accommodating tank is arranged on a first surface of the body and can accommodate the wafer part; the second accommodating tank is arranged on the first surface and connected with the first accommodating tank; and the fixing component is arranged in the second accommodating tank and can clamp the side edge of the wafer part so as to fix the wafer part into the first accommodating tank. The bearing structure can bear and fix the wafer part cut from the wafer, such as a crystal grain, a wafer, a caritive wafer, and the like. When both the bearing structure and the wafer part are put in the testing device, a more precise testing result can be obtained.
Description
technical field [0001] The present invention relates to a carrier structure and a testing device, and in particular, the present invention relates to a carrier structure and a testing device that can be combined with each other to test a diced wafer portion. Background technique [0002] In recent years, the development of semiconductor technology has led to the rapid growth of the modern electronics industry. From the living environment and working environment where people live, to the study of outer space, they are all closely related to the progress of the electronics industry. Therefore, semiconductor technology can be described as the cornerstone of modern technology. [0003] In semiconductor technology, its basic components start with the production of silicon wafers (wafers), and various structures are formed on the surface of the wafers using processing technologies such as development, etching, and deposition, and then the wafers are cut to form dies. Finally, it ...
Claims
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IPC IPC(8): H01L21/687H01L21/683H01L21/66G01R1/04G01R1/067G01R31/26
Inventor 陈升鸿王先章陈事昌
Owner RAYDIUM SEMICON