Matching method and plasma device applying same

Abstract

The invention discloses a matching method and a plasma device applying the same. The method comprises the steps of: firstly, calculating a real part or an imaginary part of the resistance through the digital quantity obtained by a sensor, secondly, taking difference values of real parts or imaginary parts of the resistance calculated by various control periods, and comparing the difference valuesto find a mutant difference value, wherein the control period in which the mutant difference value is positioned enters a luminance build-up band of a plasma; and finally, utilizing a corresponding control method to control a capacitor and carry out adjustment in the luminance build-up band until the matching is achieved. The method can ensure that the adjustment of a matcher during the matching is more targeted. The matcher enters the luminance build-up band and then adopts a corresponding mode for matching to avoid the condition of repetitive adjustment near the luminance build-up band, shortens matching time, optimizes matching path, and prolongs the service life of the matcher.

Description

technical field [0001] The invention relates to a plasma generation and control technology, in particular to a matching method and a plasma device using the matching method. Background technique [0002] In an RF (radio frequency) plasma generator, an RF generator with a constant output impedance (usually 50Ω) generates a fixed frequency (usually 13.56MHz) of RF waves to provide RF power to the plasma reaction chamber to excite the Plasma for etching or other processes. Generally speaking, the impedance of the nonlinear load of the plasma chamber is not equal to the constant output impedance of the RF generator, so there is a serious impedance mismatch between the RF generator and the plasma chamber, resulting in a large impedance on the RF transmission line. The reflected power of the RF generator cannot be fully delivered to the reaction chamber. [0003] Such as figure 1 As shown, in order to solve the above problems, an impedance matcher is inserted between the RF gen...

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Problems solved by technology

[0007] During the matching process, because it is impossible to judge when the plasma starts to glow, the capacitance adjustment may leave the starting zone after entering the starting zone, resulting in repeated adjustments, which makes the matching time longer and the matching path unreasonable

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