Method for preparing wearproof electric corrosion-resisting alloy layer on pure copper surface through magnetron sputtering
A magnetron sputtering and anti-corrosion technology, which is applied in surface polishing machine tools, sputtering coating, metal material coating technology, etc., to achieve high current breaking capacity, good purification and activation effect, and high voltage withstand capacity
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Embodiment 1
[0024] A pure copper plate with a thickness of 2mm, with a length and width of 10mm×20mm, is coated with a layer of Cu-Cr wear-resistant and anti-corrosion alloy on its surface by magnetron sputtering. The process steps are:
[0025] The first step is to polish the pure copper surface and install it in the furnace, and then vacuumize it to about 5×10 -2 Pa, through argon to 15Pa;
[0026] The second step is to connect the DC power supply A, apply a 200V negative bias voltage between the pure copper parts and the vacuum chamber shell, and purify and activate the pure copper surface through glow ion bombardment, remove the oil film on the surface, and oxidize the surface. film, the bombardment time is 10min, and the DC power supply is turned off;
[0027] The third step, connect the DC power supply B, add 300 volts of negative bias between the Cu-Cr (15%wt) alloy magnetron target and the vacuum chamber shell, and bombard the Cu-Cr alloy target by glow ions, so that Atoms on th...
Embodiment 2
[0030] A pure copper plate with a thickness of 5mm and a length and width of 12mm×25mm is coated with a layer of Cu-Cr wear-resistant and anti-corrosion alloy on its surface by magnetron sputtering. The process steps are the same as above, and the specific parameters are:
[0031] After polishing the pure copper surface, put it into the furnace and vacuumize it to about 10 -1 Pa, pass argon gas to 25Pa; connect the DC power supply A, apply a 300V negative bias voltage between the pure copper parts and the vacuum chamber shell, and purify and activate the pure copper surface by glow ion bombardment to remove pure The oil film and oxide film on the copper surface, the bombardment time is 8min, turn off the DC power supply A; then connect the DC power supply B, and add a 400 volt negative bias between the Cu-Cr (20%wt) alloy magnetron target and the vacuum chamber shell By bombarding the Cu-Cr alloy target with glow ions, the atoms on the surface of the target escape with a certa...
Embodiment 3
[0033] A pure copper plate with a thickness of 8mm and a length and width of 15mm×30mm is coated with a layer of Cu-Cr wear-resistant and anti-corrosion alloy on its surface by magnetron sputtering. The process steps are the same as above, and the specific parameters are:
[0034] Put the pure copper surface into the furnace after polishing, evacuate to about 1Pa, pass argon gas to 30Pa; connect the DC power supply A, apply a 400V negative bias voltage between the pure copper parts and the vacuum chamber shell, and bombard it with glow ions Carry out purification and activation pretreatment to the pure copper surface, remove the oil film and oxide film on the pure copper surface, bombard for 6 minutes, turn off the DC power supply A; A negative bias of 500 volts is applied between the shell and the vacuum chamber, and the Cu-Cr alloy target is bombarded by glow ions, so that the surface atoms of the target escape with a certain energy, and then deposit on the surface of the pur...
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