Method for ion plating wear resistant anti-electric corrosion alloy on pure copper surface
An ion plating and anti-corrosion technology, applied in ion implantation plating, sputtering plating, vacuum evaporation plating, etc., can solve the problem of high production cost of arc melting method, reduction of contact current breaking capacity, uniformity of material structure Low-level problems, to achieve good anti-welding performance, good activation effect, high affinity effect
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Embodiment 1
[0024] A pure copper plate with a thickness of 2mm, with a length and width of 10mm×20mm, is ion-plated on its surface with a layer of wear-resistant and anti-corrosion alloy. The process steps are:
[0025] The first step is to polish and degrease the pure copper surface and install it in the furnace;
[0026] The second step, vacuumize to about 5×10 -2 Pa, pass argon gas to 20Pa, connect the DC power supply, apply a 350V negative bias voltage between the pure copper parts and the vacuum chamber shell, and purify and activate the pure copper surface through glow ion bombardment to remove pure copper Surface oil film, oxide film, time 8min;
[0027] The third step is to turn on the arc power supply, arc discharge is generated between the arc hook and the alloy target Cu-Cr (20%wt), the single target operating current is 35A, and the time is 180min, the target particles evaporated by the magnetron arc are deposited On the surface of pure copper, a uniform coating layer is for...
Embodiment 2
[0030] A pure copper plate with a thickness of 5mm, with a length and width of 12mm×25mm, is ion-plated on its surface with a layer of wear-resistant and anti-corrosion alloy. The process steps are the same as above, and the specific parameters are:
[0031] Polish the surface of pure copper, degrease it and load it into the furnace; vacuumize to about 10 -1 Pa, pass argon gas to 25Pa; connect the DC power supply, apply a 400V negative bias voltage between the pure copper parts and the vacuum chamber shell, purify and activate the pure copper surface through glow ion bombardment, and remove the pure copper Oil film and oxide film on the surface, the time is 6min; then the arc power supply is turned on, arc discharge is generated between the arc hook and the alloy target Cu-Cr (25%wt), the single target working current is 40A, the time is 120min, and the magnetron arc Evaporated target particles are deposited on the surface of pure copper to form a uniformly plated Cu-Cr alloy ...
Embodiment 3
[0033] A pure copper plate with a thickness of 8mm, with a length and width of 15mm×30mm, is ion-plated on its surface with a layer of wear-resistant and anti-corrosion alloy. The process steps are the same as above, and the specific parameters are:
[0034] Polish the surface of pure copper and degrease it before loading into the furnace; evacuate to about 1Pa, pass argon gas to 25Pa, connect the DC power supply, apply a 450V negative bias voltage between the pure copper parts and the vacuum chamber shell, and pass the glow Purify and activate the surface of pure copper by photoion bombardment, remove the oil film and oxide film on the surface of pure copper for 5 minutes; Arc discharge is generated, the working current of a single target is 55A, and the time is 60min. A uniformly plated Cu-Cr alloy layer is formed on the surface of pure copper, and its composition is consistent with that of the target material; Cool down and polish after coming out of the furnace.
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