Method for ion plating wear resistant anti-electric corrosion alloy on pure copper surface
An ion plating and anti-corrosion technology, applied in ion implantation plating, sputtering plating, vacuum evaporation plating, etc., can solve the problem of high production cost of arc melting method, reduction of contact current breaking capacity, uniformity of material structure Low-level problems, to achieve good anti-welding performance, good activation effect, high affinity effect
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Embodiment 1
[0024] A pure copper sheet with a thickness of 2mm, a length and a width of 10mm×20mm, ion plating a layer of wear-resistant and anti-corrosion alloy on its surface, the process steps are:
[0025] The first step is to polish and degrease the surface of the pure copper and install it into the furnace;
[0026] The second step, vacuum to about 5×10 -2 Pa, blow argon to 20Pa, switch on the DC power supply, apply a negative bias voltage of 350V between the pure copper part and the vacuum chamber shell, purify and activate the surface of the pure copper by glow ion bombardment to remove the pure copper Oil film and oxide film on the surface, time 8min;
[0027] The third step, turn on the arc power supply, arc discharge is generated between the arc hook and the alloy target Cu-Cr (20%wt), the single target working current is 35A, the time is 180min, and the target particles evaporated by the magnetron arc are deposited On the surface of pure copper, a uniform plating layer is formed, ...
Embodiment 2
[0030] A pure copper sheet with a thickness of 5mm with a length and width of 12mm×25mm. The surface is ion-plated with a layer of wear-resistant and anti-corrosion alloy. The process steps are the same as the above. The specific parameters are:
[0031] After polishing the surface of pure copper and degreasing treatment, install it into the furnace; vacuumize to about 10 -1 Pa, argon gas to 25Pa; turn on the DC power supply, apply 400V negative bias between the pure copper part and the vacuum chamber shell, purify and activate the pure copper surface by glow ion bombardment to remove the pure copper Oil film and oxide film on the surface, time 6min; then turn on the arc power supply, arc discharge occurs between the arc hook and alloy target Cu-Cr (25%wt), single target working current is 40A, time 120min, magnetron arc The evaporated target particles are deposited on the surface of pure copper to form a uniformly plated Cu-Cr alloy layer whose composition is the same as that of ...
Embodiment 3
[0033] A pure copper sheet with a thickness of 8mm, the length and width dimensions are 15mm×30mm, and a layer of wear-resistant and anti-corrosion alloy is ion-plated on its surface. The process steps are the same as above. The specific parameters are:
[0034] After polishing and degreasing the surface of the pure copper, install the furnace; vacuumize to about 1Pa, ventilate argon to 25Pa, switch on the DC power supply, apply a negative bias of 450V between the pure copper part and the vacuum chamber shell, and pass the vacuum Photoion bombardment is used to purify and activate the surface of pure copper, remove the oil film and oxide film on the surface of pure copper, for 5 minutes; then turn on the arc power supply, and the arc hook and the alloy target Cu-Cr (30%wt) are between Generate arc discharge, single target working current is 55A, time 60min, a uniformly plated Cu-Cr alloy layer is formed on the surface of pure copper, its composition is consistent with the target m...
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