Island-embedded chip packaging structure with upright radiating block and external heating cap

Abstract

The invention relates to an island-embedded chip packaging structure with an upright radiating block and an external heating cap, which comprises a chip (3), a metal island (1), metal internal pins (4), metal wires (5), a conducting or non-conducting heat conduction adhesive material I (2) arranged between the chip and the metal island and a plastic-sealed body (8), wherein the metal island (1) is embedded in the plastic-sealed body (8). The island-embedded chip packaging structure is characterized in that the radiating block (7) is arranged above the chip (3) and a conducting or non-conducting heat conduction adhesive material II (6) is embedded between the radiating block (7) and the chip (3); the radiating cap (11) is arranged above the radiating block (7), a conducting or non-conducting heat conduction adhesive material III (13) is embedded between the heating cap (11) and the radiating block (7) and the heating cap (11) is sleeved on the plastic-sealed body (8). The packaging structure can provide strong heat dissipation capability.

Description

(1) Technical field [0001] The invention relates to a packaging structure of a base island embedded in a chip and a heat dissipation block externally connected with a heat dissipation cap. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island ...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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