Radiating block packaging structure with inside pin embedded in chip upside-down mounting band

Abstract

The invention relates to a radiating block packaging structure with an inside pin embedded in a chip upside-down mounting band. The radiating block packaging structure comprises a chip (3), a metal inside pin (4) loaded below the chip, a metal bump (10) for signal interconnection from the chip to the metal inside pin, a conducting or non-conducting heat-conducting bonding substance I (2) between the chip and the metal inside pin, and a plastic-sealed body (8), wherein the metal inside pin (4) is embedded in the plastic-sealed body (8). The radiating block packaging structure is characterized in that: a radiating block (7) is arranged above the chip (3), and a conducting or non-conducting heat-conducting bonding substance II (6) is embedded between the radiating block (7) and the chip (3). For the radiating block packaging structure, the radiating block is additionally arranged above the chip, has a function of radiating high heat, and has a strong radiating capacity to ensure that the heat of the chip can be quickly conducted to the outside of the packaging body.

Description

technical field [0001] The invention relates to a package structure and a package method of internal pin embedded chip flip-chip with heat dissipation block. It belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet (such as figure 1 and figure 2 As shown), so the effective area and volume of the metal-based island are very small, and at the same time, ...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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