Upright packaging structure with paddle exposing chip for heat dissipation block externally connected with heat dissipation plate

Abstract

The invention relates to an upright packaging structure with a paddle exposing a chip for a heat dissipation block externally connected with a heat dissipation plate, comprising a chip (3), a metal paddle (1) carried below the chip, a metal inner pin (4), a metal wire (5) interconnecting signals between the chip and the metal inner pin, a conductive or nonconductive heat-conducting bonding substance I (2) between the chip and the metal paddle and a plastic package body (8), wherein the metal paddle (1) exposes the plastic package body (8). The packaging structure is characterized in that the heat dissipation block (7) is arranged above the chip (3), a conductive or nonconductive heat-conducting bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); a heat dissipation plate (11) is arranged above the heat dissipation block (7) and a conductive or nonconductive heat-conducting bonding substance III (13) is embedded between the heat dissipation block (7) and the heat dissipation plate (11). The packaging structure has strong ability of heat dissipation.

Description

(1) Technical field [0001] The invention relates to a packaging structure for exposing a chip on a base island, mounting a heat dissipation block and externally connecting a heat dissipation plate. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-base...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

Images