Upright packaging structure with paddle exposing chip for inverted T-shape locking hole heat dissipation block externally connected with radiator

Abstract

The invention relates to an upright packaging structure with a paddle exposing a chip for an inverted T-shape locking hole heat dissipation block externally connected with a radiator, comprising the chip (3), the metal paddle (1), a metal inner pin (4), a metal wire (5), a conductive or nonconductive heat-conducting bonding substance I (2) and a plastic package body (8). The metal paddle (1) exposes the plastic package body (8), the heat dissipation block (7) is arranged above the chip (3) and is provided with locking holes (7.1), a conductive or nonconductive heat-conducting bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); the radiator (11) is arranged above the heat dissipation block (7) and is fixedly connected with the heat dissipation block (7) by using screws through the locking hole (7.1) and the heat dissipation block (7) is in an inverted T-shaped structure. The invention has strong ability of heat dissipation so that the heat of the chip can be quickly conducted to the outside of the plastic package body and the quick ageing, or even burning or burning-out of the chip is avoided.

Description

(1) Technical field [0001] The invention relates to a base island exposed chip front-mounted inverted T locking hole heat dissipation block external radiator packaging structure. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very s...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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